View source for 18473952. THERMAL CONDUCTIVE MEMBER, ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND METHOD OF REPLACING THERMAL CONDUCTIVE SHEET IN ELECTRONIC DEVICE simplified abstract (Panasonic Intellectual Property Management Co., Ltd.)

=THERMAL CONDUCTIVE MEMBER, ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND METHOD OF REPLACING THERMAL CONDUCTIVE SHEET IN ELECTRONIC DEVICE=


==Organization Name==

[[:Category:Panasonic Intellectual Property Management Co., Ltd.|Panasonic Intellectual Property Management Co., Ltd.]]


[[Category:Panasonic Intellectual Property Management Co., Ltd.]]

==Inventor(s)==

[[:Category:Youji Shirato of Hokkaido (JP)|Youji Shirato of Hokkaido (JP)]][[Category:Youji Shirato of Hokkaido (JP)]]

[[:Category:Norihiro Kawamura of Hokkaido (JP)|Norihiro Kawamura of Hokkaido (JP)]][[Category:Norihiro Kawamura of Hokkaido (JP)]]

==THERMAL CONDUCTIVE MEMBER, ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND METHOD OF REPLACING THERMAL CONDUCTIVE SHEET IN ELECTRONIC DEVICE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18473952 titled 'THERMAL CONDUCTIVE MEMBER, ELECTRONIC DEVICE, METHOD OF MANUFACTURING ELECTRONIC DEVICE, AND METHOD OF REPLACING THERMAL CONDUCTIVE SHEET IN ELECTRONIC DEVICE

==Simplified Explanation==

The abstract describes a thermal conductive member with a thermal conductive sheet and an adhesive member that decreases adhesive force with temperature rise.

* Thermal conductive member with adhesive member
* Adhesive force decreases with temperature rise

== Potential Applications ==
The technology could be applied in various industries such as electronics, automotive, aerospace, and more where thermal management is crucial.

== Problems Solved ==
1. Improved thermal conductivity
2. Temperature-dependent adhesive force

== Benefits ==
1. Enhanced heat dissipation
2. Secure bonding under varying temperatures

== Potential Commercial Applications ==
Optimizing heat transfer in electronic devices for improved performance and longevity.

== Possible Prior Art ==
There may be existing patents related to thermal conductive materials with adhesive properties, but further research is needed to identify specific prior art.

== Unanswered Questions ==

=== How does the adhesive member maintain its structural integrity at high temperatures? ===
The abstract does not provide details on the specific mechanism that allows the adhesive member to decrease its adhesive force with temperature rise while maintaining its functionality.

=== What are the specific industries or products that could benefit most from this technology? ===
While the abstract mentions potential applications in various industries, it does not specify which ones could see the most significant advantages from this thermal conductive member.


==Original Abstract Submitted==

A thermal conductive member includes a thermal conductive sheet and an adhesive member. The adhesive member is stacked on a front surface of the thermal conductive sheet. An adhesive force of the adhesive member decreases along with a temperature rise.



[[Category:H05K7/20]]