View source for 18401729. SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF RETICLE IN SEMICONDUCTOR MANUFACTURING simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

=SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF RETICLE IN SEMICONDUCTOR MANUFACTURING=


==Organization Name==

[[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]


[[Category:Taiwan Semiconductor Manufacturing Company, Ltd.]]

==Inventor(s)==

[[:Category:Yueh-Lin Yang of Tainan City (TW)|Yueh-Lin Yang of Tainan City (TW)]][[Category:Yueh-Lin Yang of Tainan City (TW)]]

[[:Category:Chi-Hung Liao of New Taipei City (TW)|Chi-Hung Liao of New Taipei City (TW)]][[Category:Chi-Hung Liao of New Taipei City (TW)]]

==SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF RETICLE IN SEMICONDUCTOR MANUFACTURING - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18401729 titled 'SYSTEM AND METHOD FOR THERMAL MANAGEMENT OF RETICLE IN SEMICONDUCTOR MANUFACTURING

==Simplified Explanation==

The semiconductor processing method described in the abstract involves selecting a target state of a reticle based on temperature profiles correlated to overlay performance, regulating the reticle to reach the target state, and performing an exposure process on a target workpiece using the reticle.

* The method involves selecting a target state of a reticle based on temperature profiles correlated to overlay performance.
* The reticle is regulated to reach the target state where deformation is substantially unchanged.
* An exposure process is performed on a target workpiece using the reticle.

== Potential Applications ==
This technology could be applied in semiconductor manufacturing processes to improve overlay performance and ensure consistent deformation of reticles.

== Problems Solved ==
This technology helps in maintaining the desired deformation of reticles during semiconductor processing, which can impact the quality and accuracy of the final product.

== Benefits ==
The benefits of this technology include improved overlay performance, consistent deformation control of reticles, and enhanced quality of semiconductor products.

== Potential Commercial Applications ==
This technology could find commercial applications in semiconductor fabrication facilities, where precise overlay performance and reticle deformation control are crucial for producing high-quality semiconductor devices.

== Possible Prior Art ==
One possible prior art in this field could be the use of temperature control systems in semiconductor manufacturing processes to regulate the deformation of reticles.

=== Unanswered Questions ===

=== How does this technology impact the overall efficiency of semiconductor manufacturing processes? ===
This technology can potentially improve the efficiency of semiconductor manufacturing processes by ensuring consistent overlay performance and deformation control of reticles, leading to higher quality products.

=== What are the potential cost implications of implementing this technology in semiconductor fabrication facilities? ===
The implementation of this technology may involve initial investment in equipment and systems for regulating reticle deformation based on temperature profiles, which could impact the overall cost of semiconductor manufacturing processes.


==Original Abstract Submitted==

A semiconductor processing method includes: selecting a target state of a reticle based on a given data set, wherein the given data set comprises temperature profiles of the reticle correlated to a target overlay performance, and the target state is a state in which a deformation of the reticle is substantially unchanged; regulating the reticle to reach the target state; and performing an exposure process on a target workpiece by using the reticle.



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