View source for 18381288. SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITION FOR TEMPORARY FIXATION MATERIAL, FILM FOR TEMPORARY FIXATION MATERIAL, AND LAMINATED FILM FOR TEMPORARY FIXATION MATERIAL simplified abstract (RESONAC CORPORATION)

=SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITION FOR TEMPORARY FIXATION MATERIAL, FILM FOR TEMPORARY FIXATION MATERIAL, AND LAMINATED FILM FOR TEMPORARY FIXATION MATERIAL=


==Organization Name==

[[:Category:RESONAC CORPORATION|RESONAC CORPORATION]]


[[Category:RESONAC CORPORATION]]

==Inventor(s)==

[[:Category:Emi Miyazawa of Tokyo (JP)|Emi Miyazawa of Tokyo (JP)]][[Category:Emi Miyazawa of Tokyo (JP)]]

[[:Category:Tsuyoshi Hayasaka of Tokyo (JP)|Tsuyoshi Hayasaka of Tokyo (JP)]][[Category:Tsuyoshi Hayasaka of Tokyo (JP)]]

[[:Category:Takashi Kawamori of Tokyo (JP)|Takashi Kawamori of Tokyo (JP)]][[Category:Takashi Kawamori of Tokyo (JP)]]

[[:Category:Shinichiro Sukata of Tokyo (JP)|Shinichiro Sukata of Tokyo (JP)]][[Category:Shinichiro Sukata of Tokyo (JP)]]

[[:Category:Yoshihito Inaba of Tokyo (JP)|Yoshihito Inaba of Tokyo (JP)]][[Category:Yoshihito Inaba of Tokyo (JP)]]

[[:Category:Keisuke Nishido of Tokyo (JP)|Keisuke Nishido of Tokyo (JP)]][[Category:Keisuke Nishido of Tokyo (JP)]]

==SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITION FOR TEMPORARY FIXATION MATERIAL, FILM FOR TEMPORARY FIXATION MATERIAL, AND LAMINATED FILM FOR TEMPORARY FIXATION MATERIAL - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18381288 titled 'SEMICONDUCTOR DEVICE MANUFACTURING METHOD, CURABLE RESIN COMPOSITION FOR TEMPORARY FIXATION MATERIAL, FILM FOR TEMPORARY FIXATION MATERIAL, AND LAMINATED FILM FOR TEMPORARY FIXATION MATERIAL

==Simplified Explanation==

The patent application describes a method for manufacturing a semiconductor device by separating a semiconductor member from a supporting member using incoherent light.

* Preparation of a laminated body:
    - A supporting member, a temporary fixation material layer, and a semiconductor member are laminated in that order.
    - The temporary fixation material layer generates heat upon absorbing light.

* Separation step:
    - The temporary fixation material layer in the laminated body is irradiated with incoherent light.
    - This process separates the semiconductor member from the supporting member.

== Potential Applications ==
This technology can be applied in the manufacturing of various semiconductor devices, such as integrated circuits, sensors, and memory chips.

== Problems Solved ==
This method eliminates the need for harsh chemicals or mechanical processes to separate the semiconductor member from the supporting member, reducing the risk of damage to the semiconductor device.

== Benefits ==
- Improved efficiency in semiconductor device manufacturing.
- Reduced risk of damage to the semiconductor member during separation.
- Environmentally friendly process compared to traditional methods.

== Potential Commercial Applications ==
"Semiconductor Device Manufacturing Method Using Incoherent Light" can be utilized in the production of consumer electronics, automotive components, and industrial machinery.

== Possible Prior Art ==
There may be prior art related to methods for separating semiconductor members from supporting members, such as chemical etching or mechanical peeling processes.

=== Unanswered Questions ===

=== How does this method compare to traditional separation techniques in terms of cost and time efficiency? ===
This article does not provide a direct comparison between this method and traditional separation techniques in terms of cost and time efficiency.

=== What are the potential limitations or challenges of using incoherent light for separating semiconductor members from supporting members? ===
The article does not address any potential limitations or challenges that may arise when using incoherent light for this purpose.


==Original Abstract Submitted==

Disclosed is a semiconductor device manufacturing method, including a preparation step of preparing a laminated body in which a supporting member, a temporary fixation material layer that generates heat upon absorbing light, and a semiconductor member are laminated in this order, and a separation step of irradiating the temporary fixation material layer in the laminated body with incoherent light and thereby separating the semiconductor member from the supporting member.



[[Category:C09J4/06]]
[[Category:B32B7/12]]
[[Category:B32B17/06]]
[[Category:B32B37/12]]
[[Category:B32B43/00]]
[[Category:C09J7/30]]
[[Category:C09J9/02]]
[[Category:C09J11/04]]
[[Category:H01L21/683]]