View source for 18244466. PIXEL ISOLATION STRUCTURES AND METHODS OF MAKING THEM simplified abstract (Applied Materials, Inc.)

=PIXEL ISOLATION STRUCTURES AND METHODS OF MAKING THEM=


==Organization Name==

[[:Category:Applied Materials, Inc.|Applied Materials, Inc.]]


[[Category:Applied Materials, Inc.]]

==Inventor(s)==

[[:Category:Zhiyong Li of Foster City CA (US)|Zhiyong Li of Foster City CA (US)]][[Category:Zhiyong Li of Foster City CA (US)]]

[[:Category:Sivapackia Ganapathiappan of Los Altos CA (US)|Sivapackia Ganapathiappan of Los Altos CA (US)]][[Category:Sivapackia Ganapathiappan of Los Altos CA (US)]]

[[:Category:Kulandaivelu Sivanandan of Fremont CA (US)|Kulandaivelu Sivanandan of Fremont CA (US)]][[Category:Kulandaivelu Sivanandan of Fremont CA (US)]]

[[:Category:Hao Yu of Los Angeles CA (US)|Hao Yu of Los Angeles CA (US)]][[Category:Hao Yu of Los Angeles CA (US)]]

[[:Category:Hou T. Ng of Campbell CA (US)|Hou T. Ng of Campbell CA (US)]][[Category:Hou T. Ng of Campbell CA (US)]]

[[:Category:Nag Patibandla of Pleasanton CA (US)|Nag Patibandla of Pleasanton CA (US)]][[Category:Nag Patibandla of Pleasanton CA (US)]]

[[:Category:Mingwei Zhu of San Jose CA (US)|Mingwei Zhu of San Jose CA (US)]][[Category:Mingwei Zhu of San Jose CA (US)]]

[[:Category:Lisong Xu of San Jose CA (US)|Lisong Xu of San Jose CA (US)]][[Category:Lisong Xu of San Jose CA (US)]]

[[:Category:Kai Ding of Fremont CA (US)|Kai Ding of Fremont CA (US)]][[Category:Kai Ding of Fremont CA (US)]]

==PIXEL ISOLATION STRUCTURES AND METHODS OF MAKING THEM - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18244466 titled 'PIXEL ISOLATION STRUCTURES AND METHODS OF MAKING THEM

==Simplified Explanation==

The patent application describes methods for creating a patterned LED substrate with pixel isolation structures using a light absorption material containing photocurable compounds and ultraviolet light absorbing materials. The process involves exposing the material to patterned light to cure it into pixel isolation structures, followed by depositing an isotropic layer on top and side portions of the structures.

* LED structures are formed on a substrate layer to create a patterned LED substrate.
* A light absorption material is deposited on the patterned LED substrate, containing photocurable compounds and ultraviolet light absorbing materials.
* Exposing a portion of the light absorption material to patterned light cures it into pixel isolation structures.
* An isotropic layer is deposited on top and side portions of the pixel isolation structures.
* The LED structures are free of the as-deposited isotropic light reflecting layer.

== Potential Applications ==
The technology described in the patent application could be applied in the manufacturing of LED displays, lighting systems, and other optoelectronic devices that require precise pixel isolation structures.

== Problems Solved ==
This technology solves the problem of creating pixel isolation structures on LED substrates with high precision and efficiency, allowing for improved performance and reliability of LED devices.

== Benefits ==
The benefits of this technology include enhanced light absorption, improved pixel isolation, and overall better performance of LED devices. Additionally, the process is cost-effective and scalable for mass production.

== Potential Commercial Applications ==
The technology has potential commercial applications in the LED industry for manufacturing high-quality displays, lighting products, and other optoelectronic devices.

== Possible Prior Art ==
One possible prior art in this field could be the use of photolithography techniques for creating pixel isolation structures on LED substrates. However, the specific combination of materials and processes described in this patent application may be novel and innovative.

=== Unanswered Questions ===

== How does this technology compare to existing methods for creating pixel isolation structures on LED substrates? ==
The article does not provide a direct comparison with existing methods, so it is unclear how this technology differs in terms of efficiency, cost, and performance.

== What are the potential limitations or challenges in implementing this technology on an industrial scale? ==
The article does not address potential challenges or limitations in scaling up this technology for mass production, such as manufacturing complexity, material costs, or compatibility with existing production processes.


==Original Abstract Submitted==

Processing methods are described that include forming a group of LED structures on a substrate layer to form a patterned LED substrate. The methods also include depositing a light absorption material on the pattered LED substrate, where the light absorption material includes at least one photocurable compound and at least one ultraviolet light absorbing material. The methods further include exposing a portion of the light absorption material to patterned light, wherein the patterned light cures the exposed portion of the light absorption material into pixel isolation structures. The methods additionally include depositing an isotropic layer on a top portion and a side portion of the pixel isolation structures, where the LED structures are substantially free of the as-deposited isotropic light reflecting layer.



[[Category:H01L25/075]]