View source for 18237202. SEMICONDUCTOR DEVICE CIRCUITRY FORMED FROM REMOTE RESERVOIRS simplified abstract (Micron Technology, Inc.)

=SEMICONDUCTOR DEVICE CIRCUITRY FORMED FROM REMOTE RESERVOIRS=


==Organization Name==

[[:Category:Micron Technology, Inc.|Micron Technology, Inc.]]


[[Category:Micron Technology, Inc.]]

==Inventor(s)==

[[:Category:Kyle K. Kirby of Eagle ID (US)|Kyle K. Kirby of Eagle ID (US)]][[Category:Kyle K. Kirby of Eagle ID (US)]]

[[:Category:Terrence B. Mcdaniel of Boise ID (US)|Terrence B. Mcdaniel of Boise ID (US)]][[Category:Terrence B. Mcdaniel of Boise ID (US)]]

==SEMICONDUCTOR DEVICE CIRCUITRY FORMED FROM REMOTE RESERVOIRS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18237202 titled 'SEMICONDUCTOR DEVICE CIRCUITRY FORMED FROM REMOTE RESERVOIRS

==Simplified Explanation==

This document describes a method for forming semiconductor device circuitry using remote reservoirs.

* A semiconductor assembly includes a first semiconductor die with a reservoir of conductive material located adjacent to an opening.
* A second semiconductor die includes a contact pad corresponding to the opening.
* The reservoir of conductive material is heated to expand and form an interconnect electrically coupling the first and second semiconductor dies.

**Potential Applications:**

* Semiconductor manufacturing
* Integrated circuit design
* Electronic device production

**Problems Solved:**

* Improving connectivity between semiconductor dies
* Enhancing performance of semiconductor devices
* Facilitating efficient assembly processes

**Benefits:**

* Increased reliability of semiconductor devices
* Enhanced electrical connections
* Streamlined manufacturing processes


==Original Abstract Submitted==

This document discloses techniques, apparatuses, and systems for semiconductor device circuitry formed from remote reservoirs. A semiconductor assembly includes a first semiconductor die with a layer of dielectric material having an opening. The first semiconductor die further includes a reservoir of conductive material having a first portion located adjacent to the opening, a second portion remote from the opening, and a third portion coupling the first portion and the second portion. A second semiconductor die includes a layer of dielectric material and a contact pad corresponding to the opening. The reservoir of conductive material is heated to volumetrically expand the second portion into the third portion, the third portion into the first portion, and the first portion through the opening to form an interconnect electrically coupling the first semiconductor die and the second semiconductor die at the contact pad. In this way, a connected semiconductor device may be assembled.



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