View source for 18227803. LASER ANNEALING APPARATUS AND METHOD OF MANUFACTURING SUBSTRATE INCLUDING POLY-SI LAYER USING THE SAME simplified abstract (SAMSUNG DISPLAY CO., LTD.)

=LASER ANNEALING APPARATUS AND METHOD OF MANUFACTURING SUBSTRATE INCLUDING POLY-SI LAYER USING THE SAME=


==Organization Name==

[[:Category:SAMSUNG DISPLAY CO., LTD.|SAMSUNG DISPLAY CO., LTD.]]


[[Category:SAMSUNG DISPLAY CO., LTD.]]

==Inventor(s)==

[[:Category:Dongeon Lim of Yongin-si (KR)|Dongeon Lim of Yongin-si (KR)]][[Category:Dongeon Lim of Yongin-si (KR)]]

[[:Category:Kyongsik Choi of Yongin-si (KR)|Kyongsik Choi of Yongin-si (KR)]][[Category:Kyongsik Choi of Yongin-si (KR)]]

==LASER ANNEALING APPARATUS AND METHOD OF MANUFACTURING SUBSTRATE INCLUDING POLY-SI LAYER USING THE SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18227803 titled 'LASER ANNEALING APPARATUS AND METHOD OF MANUFACTURING SUBSTRATE INCLUDING POLY-SI LAYER USING THE SAME

==Simplified Explanation==

The abstract describes a laser annealing apparatus that includes two laser beam sources emitting beams in different directions, a longitudinal optical system that expands the width of the beams, and a rotatable wedge lens.

* The laser annealing apparatus uses two laser beam sources emitting beams in different directions.
* A longitudinal optical system is used to expand the width of the laser beams.
* A rotatable wedge lens is placed between the laser beam source and the longitudinal optical system.
* The wedge lens can be rotated within a preset angle in a direction perpendicular to the beams.

Potential applications of this technology:
* Laser annealing is commonly used in the semiconductor industry for processes like dopant activation, recrystallization, and defect annealing.
* This apparatus can be used for precise and controlled laser annealing in semiconductor manufacturing.
* It can also be used in other industries that require laser annealing, such as solar cell manufacturing or display panel production.

Problems solved by this technology:
* Laser annealing requires precise control of the laser beam width and direction.
* The longitudinal optical system in this apparatus expands the width of the laser beams, ensuring uniform annealing across the target area.
* The rotatable wedge lens allows for fine adjustments in the beam direction, enabling precise annealing in different directions.

Benefits of this technology:
* The use of two laser beam sources and the longitudinal optical system ensures uniform and controlled annealing.
* The rotatable wedge lens provides flexibility in adjusting the beam direction, allowing for versatile annealing processes.
* The apparatus can improve the efficiency and quality of laser annealing processes in various industries.


==Original Abstract Submitted==

A laser annealing apparatus includes a first laser beam source emitting a first laser beam in a first direction, a second laser beam source disposed apart from the first laser beam source in a second direction perpendicular to the first direction and emitting a second laser beam in the first direction, a longitudinal optical system to which the first laser beam and the second laser beam are incident, and the longitudinal optical system expanding a width of each of the first laser beam and the second laser beam in the second direction, and a first wedge lens arranged between the first laser beam source and the longitudinal optical system to be in an optical path of the first laser beam and being rotatable within a preset angle with respect to a central axis in a third direction perpendicular to the first direction and the second direction.



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