View source for 18174610. LEAD FRAME AND SEMICONDUCTOR DEVICE simplified abstract (KABUSHIKI KAISHA TOSHIBA)

=LEAD FRAME AND SEMICONDUCTOR DEVICE=


==Organization Name==

[[:Category:KABUSHIKI KAISHA TOSHIBA|KABUSHIKI KAISHA TOSHIBA]]


[[Category:KABUSHIKI KAISHA TOSHIBA]]

==Inventor(s)==

[[:Category:Kazuhiro Watanabe of Ibo Hyogo (JP)|Kazuhiro Watanabe of Ibo Hyogo (JP)]][[Category:Kazuhiro Watanabe of Ibo Hyogo (JP)]]

==LEAD FRAME AND SEMICONDUCTOR DEVICE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18174610 titled 'LEAD FRAME AND SEMICONDUCTOR DEVICE

==Simplified Explanation==

The lead frame described in the abstract is a component used in semiconductor packaging that includes a main body portion with a mounting region for a semiconductor chip, a lead portion, a groove portion surrounding the mounting region, and a protruding portion along the inner edge of the groove.

* Main body portion with mounting region for semiconductor chip
* Lead portion connected to main body portion
* Groove portion surrounding mounting region with inner and outer side surfaces
* Protruding portion along inner edge of groove

== Potential Applications ==
The lead frame technology can be used in various semiconductor packaging applications such as integrated circuits, microprocessors, and memory devices.

== Problems Solved ==
This lead frame design helps in providing structural support and electrical connections for semiconductor chips during the packaging process, ensuring reliable performance and longevity of the electronic devices.

== Benefits ==
- Improved structural support for semiconductor chips
- Enhanced electrical connections
- Increased reliability and longevity of electronic devices

== Potential Commercial Applications ==
The lead frame technology can be utilized by semiconductor manufacturers, electronic component suppliers, and companies involved in the production of consumer electronics.

== Possible Prior Art ==
Prior art in lead frame technology includes various designs and configurations used in semiconductor packaging processes to provide support and connectivity for semiconductor chips.

=== Unanswered Questions ===

=== How does the protruding portion enhance the functionality of the lead frame? ===
The protruding portion along the inner edge of the groove is designed to provide additional support and stability to the semiconductor chip during the packaging process. This feature helps in securing the chip in place and ensuring proper alignment for electrical connections.

=== What materials are commonly used in manufacturing lead frames? ===
Lead frames are typically made from materials such as copper, copper alloys, or iron-nickel alloys due to their excellent electrical conductivity, thermal properties, and mechanical strength. These materials are chosen to meet the specific requirements of the semiconductor packaging process.


==Original Abstract Submitted==

A lead frame according to the present embodiments includes: a main body portion having a main surface including a mounting region on which a semiconductor chip is to be mounted; a lead portion connected to the main body portion; a groove portion provided in a main surface of the main body portion so as to surround the mounting region, the groove portion having an inner side surface and an outer side surface; and a protruding portion protrudingly provided along an inner edge of the groove portion.



[[Category:H01L23/495]]
[[Category:H01L23/13]]
[[Category:H01L23/492]]