View source for 18166473. PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING PACKAGE STRUCTURE simplified abstract (Changxin Memory Technologies, Inc.)

=PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING PACKAGE STRUCTURE=


==Organization Name==

[[:Category:Changxin Memory Technologies, Inc.|Changxin Memory Technologies, Inc.]]


[[Category:Changxin Memory Technologies, Inc.]]

==Inventor(s)==

[[:Category:Huifang Dai of Hefei City (CN)|Huifang Dai of Hefei City (CN)]][[Category:Huifang Dai of Hefei City (CN)]]

==PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING PACKAGE STRUCTURE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18166473 titled 'PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING PACKAGE STRUCTURE

==Simplified Explanation==

The patent application describes a package structure for electronic devices that includes a substrate with multiple welding pads, a chip, and solder balls. The welding pads are stacked onto each other, with the top layer welding pads protruding from the bottom layer welding pads. The solder balls are used to connect the substrate and the chip, and they wrap around the top layer welding pads.

* The package structure includes a substrate with multiple welding pads.
* The welding pads consist of stacked bottom layer and top layer pads.
* The top layer welding pads protrude from the bottom layer pads.
* A chip is located on the substrate but spaced apart from it.
* Solder balls are used to connect the substrate and the chip.
* The solder balls wrap around the top layer welding pads.

==Potential Applications==
* Electronic devices and components manufacturing
* Semiconductor packaging industry

==Problems Solved==
* Simplifies the structure of electronic device packages
* Provides a more efficient and reliable connection between the substrate and the chip

==Benefits==
* Improved electrical connectivity and signal transmission
* Enhanced mechanical stability and durability
* Simplified manufacturing process
* Cost-effective solution for electronic device packaging


==Original Abstract Submitted==

A package structure includes: a substrate, where a plurality of welding pads are disposed on a surface of the substrate, each of the plurality of welding pads includes a bottom layer welding pad and a top layer welding pad which are stacked onto one another, and at least two of peripheral surfaces of the top layer welding pad are protruded relative to peripheral surfaces of the bottom layer welding pad; a chip located on the substrate and spaced apart from the substrate; and a plurality of solder balls, where the plurality of solder balls are welded to the substrate and the chip, and the plurality of solder balls wrap the top layer welding pads.



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