View source for 18155672. SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURING METHOD THEREOF simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

=SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURING METHOD THEREOF=


==Organization Name==

[[:Category:Taiwan Semiconductor Manufacturing Co., Ltd.|Taiwan Semiconductor Manufacturing Co., Ltd.]]


[[Category:Taiwan Semiconductor Manufacturing Co., Ltd.]]

==Inventor(s)==

[[:Category:Wei-Cheng Wu of Hsinchu City (TW)|Wei-Cheng Wu of Hsinchu City (TW)]][[Category:Wei-Cheng Wu of Hsinchu City (TW)]]

[[:Category:Chien-Chia Chiu of Taoyuan City (TW)|Chien-Chia Chiu of Taoyuan City (TW)]][[Category:Chien-Chia Chiu of Taoyuan City (TW)]]

[[:Category:Cheng-Hsien Hsieh of Kaohsiung City (TW)|Cheng-Hsien Hsieh of Kaohsiung City (TW)]][[Category:Cheng-Hsien Hsieh of Kaohsiung City (TW)]]

[[:Category:Li-Han Hsu of Hsin-Chu City (TW)|Li-Han Hsu of Hsin-Chu City (TW)]][[Category:Li-Han Hsu of Hsin-Chu City (TW)]]

[[:Category:Meng-Tsan Lee of Hsinchu (TW)|Meng-Tsan Lee of Hsinchu (TW)]][[Category:Meng-Tsan Lee of Hsinchu (TW)]]

[[:Category:Tsung-Shu Lin of New Taipei City (TW)|Tsung-Shu Lin of New Taipei City (TW)]][[Category:Tsung-Shu Lin of New Taipei City (TW)]]

==SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURING METHOD THEREOF - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18155672 titled 'SEMICONDUCTOR PACKAGE WITH REDISTRIBUTION STRUCTURE AND MANUFACTURING METHOD THEREOF

==Simplified Explanation==

The abstract describes a semiconductor package that includes a semiconductor die, a redistribution structure, and connective terminals. The redistribution structure is located on the semiconductor die and consists of a first metallization tier sandwiched between two dielectric layers. The first metallization tier includes conductive traces for routing electrical connections to the semiconductor die and a shielding plate that is electrically isolated from the semiconductor die. The connective terminals consist of dummy connective terminals and active connective terminals. The dummy connective terminals are placed on the redistribution structure and are electrically connected to the shielding plate, while the active connective terminals are also located on the redistribution structure and are electrically connected to the routing conductive traces. The vertical projections of the dummy connective terminals fall on the shielding plate.

* The semiconductor package includes a redistribution structure with a first metallization tier and dielectric layers.
* The first metallization tier contains conductive traces for routing electrical connections and a shielding plate.
* Connective terminals are present, including dummy connective terminals and active connective terminals.
* The dummy connective terminals are connected to the shielding plate, while the active connective terminals are connected to the routing conductive traces.
* The vertical projections of the dummy connective terminals fall on the shielding plate.

==Potential Applications==
* This semiconductor package design can be used in various electronic devices that require efficient electrical connections and shielding.
* It can be applied in smartphones, tablets, laptops, and other portable electronic devices.
* The technology can also be used in automotive electronics, medical devices, and industrial equipment.

==Problems Solved==
* The redistribution structure and connective terminals provide improved electrical connections and shielding for the semiconductor die.
* The inclusion of dummy connective terminals and active connective terminals allows for better control and management of electrical signals.
* The vertical projections of the dummy connective terminals falling on the shielding plate enhance the overall shielding effectiveness.

==Benefits==
* The semiconductor package design offers enhanced electrical performance and signal integrity.
* It provides improved electromagnetic interference (EMI) shielding, reducing the impact of external interference on the semiconductor die.
* The technology allows for more efficient use of space within the semiconductor package, enabling smaller and more compact electronic devices.


==Original Abstract Submitted==

A semiconductor package includes a semiconductor die, a redistribution structure and connective terminals. The redistribution structure is disposed on the semiconductor die and includes a first metallization tier disposed in between a pair of dielectric layers. The first metallization tier includes routing conductive traces electrically connected to the semiconductor die and a shielding plate electrically insulated from the semiconductor die. The connective terminals include dummy connective terminals and active connective terminals. The dummy connective terminals are disposed on the redistribution structure and are electrically connected to the shielding plate. The active connective terminals are disposed on the redistribution structure and are electrically connected to the routing conductive traces. Vertical projections of the dummy connective terminals fall on the shielding plate.



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