View source for 18107427. METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING TOOL simplified abstract (Taiwan Semiconductor Manufacturing Company, Ltd.)

=METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING TOOL=


==Organization Name==

[[:Category:Taiwan Semiconductor Manufacturing Company, Ltd.|Taiwan Semiconductor Manufacturing Company, Ltd.]]


[[Category:Taiwan Semiconductor Manufacturing Company, Ltd.]]

==Inventor(s)==

[[:Category:Hui-Chun Lee of Hsinchu (TW)|Hui-Chun Lee of Hsinchu (TW)]][[Category:Hui-Chun Lee of Hsinchu (TW)]]

[[:Category:Tung-Hung Feng of Hsinchu (TW)|Tung-Hung Feng of Hsinchu (TW)]][[Category:Tung-Hung Feng of Hsinchu (TW)]]

[[:Category:Peng-Ting Lee of Hsinchu City (TW)|Peng-Ting Lee of Hsinchu City (TW)]][[Category:Peng-Ting Lee of Hsinchu City (TW)]]

==METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING TOOL - A simplified explanation of the abstract==


This abstract first appeared for US patent application 18107427 titled 'METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING TOOL

==Simplified Explanation==

The patent application describes a method of manufacturing a semiconductor device using a photoresist layer. Here are the key points:

* A photoresist layer is formed on a substrate.
* The photoresist layer is selectively exposed to actinic radiation.
* The exposed photoresist layer is heated.
* During the heating process, a gas is flowed over the photoresist layer.
* The flow of the gas is varied during the heating process.
* After heating, the photoresist layer is developed to form a pattern.

Potential applications of this technology:

* Manufacturing of semiconductor devices.
* Fabrication of integrated circuits.
* Production of microchips and electronic components.

Problems solved by this technology:

* Provides a method for precise patterning of photoresist layers.
* Enables the production of complex semiconductor structures.
* Improves the efficiency and accuracy of semiconductor manufacturing processes.

Benefits of this technology:

* Allows for the creation of intricate patterns on semiconductor devices.
* Enhances the performance and functionality of electronic components.
* Increases the yield and quality of semiconductor manufacturing.
* Reduces production costs and time.


==Original Abstract Submitted==

A method of manufacturing a semiconductor device includes forming a photoresist layer including a photoresist composition over a substrate. The photoresist layer is selectively exposed to actinic radiation. The photoresist layer is heated after selectively exposing the photoresist layer to actinic radiation. A gas is flowed over the photoresist layer during the heating the photoresist layer. A flow of the gas is varied during the heating the photoresist layer, and the photoresist layer is developed after the heating the photoresist layer to form a pattern in the photoresist layer.



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