View source for 17981176. DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS IN SUBSTRATES COUPLED THROUGH FLEXIBLE INTERCONNECTS simplified abstract (QUALCOMM Incorporated)

=DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS IN SUBSTRATES COUPLED THROUGH FLEXIBLE INTERCONNECTS=


==Organization Name==

[[:Category:QUALCOMM Incorporated|QUALCOMM Incorporated]]


[[Category:QUALCOMM Incorporated]]

==Inventor(s)==

[[:Category:Jeahyeong Han of San Diego CA (US)|Jeahyeong Han of San Diego CA (US)]][[Category:Jeahyeong Han of San Diego CA (US)]]

[[:Category:Rajneesh Kumar of San Diego CA (US)|Rajneesh Kumar of San Diego CA (US)]][[Category:Rajneesh Kumar of San Diego CA (US)]]

[[:Category:Suhyung Hwang of Rancho Mission Viejo CA (US)|Suhyung Hwang of Rancho Mission Viejo CA (US)]][[Category:Suhyung Hwang of Rancho Mission Viejo CA (US)]]

[[:Category:Jaehyun Yeon of San Diego CA (US)|Jaehyun Yeon of San Diego CA (US)]][[Category:Jaehyun Yeon of San Diego CA (US)]]

[[:Category:Mohammad Ali Tassoudji of San Diego CA (US)|Mohammad Ali Tassoudji of San Diego CA (US)]][[Category:Mohammad Ali Tassoudji of San Diego CA (US)]]

[[:Category:Darryl Sheldon Jessie of San Diego CA (US)|Darryl Sheldon Jessie of San Diego CA (US)]][[Category:Darryl Sheldon Jessie of San Diego CA (US)]]

[[:Category:Ameya Galinde of San Francisco CA (US)|Ameya Galinde of San Francisco CA (US)]][[Category:Ameya Galinde of San Francisco CA (US)]]

==DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS IN SUBSTRATES COUPLED THROUGH FLEXIBLE INTERCONNECTS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17981176 titled 'DEVICE COMPRISING MULTI-DIRECTIONAL ANTENNAS IN SUBSTRATES COUPLED THROUGH FLEXIBLE INTERCONNECTS

==Simplified Explanation==

The patent application describes a device that includes two substrates with antennas, an integrated device, and a flexible connection. The device also has an encapsulation layer and a shield for electromagnetic interference (EMI) protection.

* The device has a first substrate with a first antenna and an integrated device, and a second substrate with a second antenna.
* The first substrate and the second substrate are connected by a flexible connection.
* An encapsulation layer is located over the first substrate, the integrated device, and the second substrate.
* A shield is formed over the surface of the encapsulation layer and the surface of the first substrate, providing EMI protection.

== Potential Applications ==
* Wireless communication devices
* Internet of Things (IoT) devices
* Wearable technology
* Smart home devices

== Problems Solved ==
* Electromagnetic interference (EMI) can disrupt the performance of electronic devices.
* The shield in this device helps to protect against EMI, ensuring reliable and uninterrupted operation.

== Benefits ==
* Improved performance and reliability of electronic devices.
* Enhanced protection against electromagnetic interference.
* Flexibility in design and integration of antennas and integrated devices.


==Original Abstract Submitted==

A device that includes a first substrate comprising a first antenna, an integrated device coupled to the first substrate, an encapsulation layer located over the first substrate and the integrated device, a second substrate comprising a second antenna, and a flexible connection coupled to the first substrate and the second substrate. The device includes a shield formed over a surface of the encapsulation layer and a surface of the first substrate. The shield includes an electromagnetic interference (EMI) shield.



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