View source for 17956789. COMPONENT COOLER WITH MULTIPLE HEAT TRANSFER PATHS simplified abstract (ADVANCED MICRO DEVICES, INC.)

=COMPONENT COOLER WITH MULTIPLE HEAT TRANSFER PATHS=


==Organization Name==

[[:Category:ADVANCED MICRO DEVICES, INC.|ADVANCED MICRO DEVICES, INC.]]


[[Category:ADVANCED MICRO DEVICES, INC.]]

==Inventor(s)==

[[:Category:CHRISTOPHER M. Helberg of AUSTIN TX (US)|CHRISTOPHER M. Helberg of AUSTIN TX (US)]][[Category:CHRISTOPHER M. Helberg of AUSTIN TX (US)]]

[[:Category:CHRISTOPHER M. Jaggers of AUSTIN TX (US)|CHRISTOPHER M. Jaggers of AUSTIN TX (US)]][[Category:CHRISTOPHER M. Jaggers of AUSTIN TX (US)]]

[[:Category:ROBERT EDWARD Radke of AUSTIN TX (US)|ROBERT EDWARD Radke of AUSTIN TX (US)]][[Category:ROBERT EDWARD Radke of AUSTIN TX (US)]]

==COMPONENT COOLER WITH MULTIPLE HEAT TRANSFER PATHS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17956789 titled 'COMPONENT COOLER WITH MULTIPLE HEAT TRANSFER PATHS

==Simplified Explanation==

The patent application describes an apparatus for component cooling that includes multiple thermally conductive paths between two heat transfer elements to efficiently dissipate heat generated by a component.

* The apparatus includes a first heat transfer element connected to the heat-generating component.
* A second heat transfer element is also part of the apparatus.
* Multiple thermally conductive paths are present between the first and second heat transfer elements.
* Each path provides a separate heat conduction route from the first element to the second element.

== Potential Applications ==
The technology could be applied in various electronic devices, such as computers, servers, and mobile devices, to improve cooling efficiency and prevent overheating.

== Problems Solved ==
This technology addresses the issue of heat buildup in electronic components, which can lead to performance degradation and even failure if not properly managed.

== Benefits ==
- Enhanced cooling efficiency
- Improved overall performance and reliability of electronic devices
- Extended lifespan of components

== Potential Commercial Applications ==
"Efficient Component Cooling Technology for Electronic Devices" could be used in the manufacturing of consumer electronics, industrial equipment, and data centers to optimize thermal management and ensure long-term reliability.

== Possible Prior Art ==
One possible prior art could be the use of heat pipes or heat sinks in electronic devices to dissipate heat. However, the specific configuration of multiple thermally conductive paths between heat transfer elements may be a novel aspect of this technology.

=== Unanswered Questions ===

=== How does this technology compare to traditional cooling methods in terms of cost-effectiveness and energy efficiency? ===
This article does not provide a direct comparison between this technology and traditional cooling methods. Further research or testing would be needed to determine the cost-effectiveness and energy efficiency of this innovation.

=== What are the potential challenges or limitations of implementing this technology in different types of electronic devices? ===
The article does not address the specific challenges or limitations that may arise when implementing this technology in various electronic devices. Additional studies or case studies would be necessary to understand the practical implications of this innovation.


==Original Abstract Submitted==

An apparatus for component cooling includes a first heat transfer element configured to be thermally coupled to a heat-generating component, and a second heat transfer element. The apparatus further includes a plurality of thermally conductive paths between the first heat transfer element and the second heat transfer element. Each of the plurality of thermally conductive paths are configured to provide a separate heat conduction path from the first heat transfer element to the second heat transfer element.



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