View source for 17955689. LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE INTERCONNECTS simplified abstract (Intel Corporation)

=LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE INTERCONNECTS=


==Organization Name==

[[:Category:Intel Corporation|Intel Corporation]]


[[Category:Intel Corporation]]

==Inventor(s)==

[[:Category:Jieying Kong of Chandler AZ (US)|Jieying Kong of Chandler AZ (US)]][[Category:Jieying Kong of Chandler AZ (US)]]

[[:Category:Houssam Jomaa of San Diego CA (US)|Houssam Jomaa of San Diego CA (US)]][[Category:Houssam Jomaa of San Diego CA (US)]]

[[:Category:Dilan Seneviratne of Phoenix AZ (US)|Dilan Seneviratne of Phoenix AZ (US)]][[Category:Dilan Seneviratne of Phoenix AZ (US)]]

[[:Category:Whitney Bryks of Tempe AZ (US)|Whitney Bryks of Tempe AZ (US)]][[Category:Whitney Bryks of Tempe AZ (US)]]

[[:Category:Srinivas Venkata Ramanuja Pietambaram of Phoenix AZ (US)|Srinivas Venkata Ramanuja Pietambaram of Phoenix AZ (US)]][[Category:Srinivas Venkata Ramanuja Pietambaram of Phoenix AZ (US)]]

[[:Category:Kristof Darmawikarta of Chandler AZ (US)|Kristof Darmawikarta of Chandler AZ (US)]][[Category:Kristof Darmawikarta of Chandler AZ (US)]]

==LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE INTERCONNECTS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17955689 titled 'LAYERED GLASS ASSEMBLY WITH PRE-PATTERNED ELECTRICALLY CONDUCTIVE INTERCONNECTS

==Simplified Explanation==

The electronic system described in the patent application comprises a substrate with a core layer made of at least one layer of glass. The glass layers are stacked with a dielectric material between each layer, and the glass layers are prepatterned before assembly of the layered glass core system.

* Glass layers are used in the core layer of the electronic system.
* Dielectric material is placed between each layer of glass.
* Glass layers are prepatterned before assembly.

== Potential Applications ==
The technology described in the patent application could be applied in:
* Electronic devices
* Communication systems
* Solar panels

== Problems Solved ==
This technology helps solve the following problems:
* Improved durability and reliability of electronic systems
* Enhanced performance of communication systems
* Increased efficiency of solar panels

== Benefits ==
The benefits of this technology include:
* Enhanced structural integrity of electronic systems
* Improved signal transmission in communication systems
* Higher energy conversion efficiency in solar panels

== Potential Commercial Applications ==
The technology could find commercial applications in:
* Electronics manufacturing industry
* Telecommunications sector
* Renewable energy sector

== Possible Prior Art ==
One possible prior art for this technology could be the use of glass layers in electronic systems, but the specific combination of prepatterned glass layers with dielectric material may be unique to this patent application.

=== Unanswered Questions ===

=== How does this technology compare to existing glass-based electronic systems in terms of cost-effectiveness? ===
This article does not provide information on the cost-effectiveness of the technology compared to existing glass-based electronic systems. 

=== What are the environmental implications of using glass layers in electronic systems? ===
The article does not address the environmental implications of using glass layers in electronic systems.


==Original Abstract Submitted==

An electronic system comprising can have a substrate with a core layer formed from at least one layer of glass. The glass layers can each be stacked with a dielectric material disposed between each layer of glass. The glass layers can be prepatterned before assembly of the layered glass core system.



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