View source for 17949069. HIGH DENSITY SEMICONDUCTOR DEVICE INCLUDING INTEGRATED CONTROLLER, LOGIC CIRCUIT AND MEMORY DIES simplified abstract (SanDisk Technologies LLC)

=HIGH DENSITY SEMICONDUCTOR DEVICE INCLUDING INTEGRATED CONTROLLER, LOGIC CIRCUIT AND MEMORY DIES=


==Organization Name==

[[:Category:SanDisk Technologies LLC|SanDisk Technologies LLC]]


[[Category:SanDisk Technologies LLC]]

==Inventor(s)==

[[:Category:Jayavel Pachamuthu of San Jose CA (US)|Jayavel Pachamuthu of San Jose CA (US)]][[Category:Jayavel Pachamuthu of San Jose CA (US)]]

[[:Category:Srinivasan Sivaram of Los Gatos CA (US)|Srinivasan Sivaram of Los Gatos CA (US)]][[Category:Srinivasan Sivaram of Los Gatos CA (US)]]

[[:Category:Masaaki Higashitani of Cupertino CA (US)|Masaaki Higashitani of Cupertino CA (US)]][[Category:Masaaki Higashitani of Cupertino CA (US)]]

==HIGH DENSITY SEMICONDUCTOR DEVICE INCLUDING INTEGRATED CONTROLLER, LOGIC CIRCUIT AND MEMORY DIES - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17949069 titled 'HIGH DENSITY SEMICONDUCTOR DEVICE INCLUDING INTEGRATED CONTROLLER, LOGIC CIRCUIT AND MEMORY DIES

==Simplified Explanation==

The abstract describes an integrated controller, logic circuit, and memory array semiconductor device that operates as a single flash memory device.

* Stacked controller, logic circuit, and memory array wafers or individual dies are used to create the integrated semiconductor device.
* The memory array logic circuit and memory array dies may have full-thickness plated or filled vias connecting to bond pads on opposite surfaces of the dies.
* The stacked semiconductor dies are aligned and affixed to each other to electrically and mechanically couple them together.

== Potential Applications ==
This technology could be applied in:
* Solid-state drives (SSDs)
* Embedded systems
* Mobile devices

== Problems Solved ==
* Integration of controller, logic circuit, and memory array into a single device
* Efficient data storage and retrieval
* Space-saving design for semiconductor devices

== Benefits ==
* Improved performance and reliability
* Reduced power consumption
* Simplified manufacturing process

== Potential Commercial Applications ==
Optimizing Flash Memory Devices for Enhanced Performance

== Possible Prior Art ==
One possible prior art could be the integration of multiple semiconductor components into a single device for improved functionality and efficiency.

== Unanswered Questions ==

=== How does this technology compare to traditional flash memory devices in terms of speed and capacity? ===
Answer: This article does not provide a direct comparison between this integrated semiconductor device and traditional flash memory devices.

=== What are the potential challenges in mass-producing these integrated semiconductor devices? ===
Answer: The article does not address the potential challenges in mass-producing these devices on a commercial scale.


==Original Abstract Submitted==

An integrated controller, logic circuit and memory array (“CLM”) semiconductor device includes stacked controller, memory array logic circuit and memory array wafers, or individual dies diced therefrom, which together operate as a single, integrated semiconductor flash memory device. The memory array logic circuit dies and/or the memory array dies may be formed with full-thickness plated or filled vias connecting to bond pads on opposed surfaces of the dies. The bond pads of the respective stacked semiconductor dies may be aligned and affixed to each other to electrically and mechanically couple each of the semiconductor dies in the respective wafers together.



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