View source for 17918505. PHOTONIC CHIP WITH EDGE COUPLER AND METHOD OF MANUFACTURE simplified abstract (Telefonaktiebolaget LM Ericsson (publ))

=PHOTONIC CHIP WITH EDGE COUPLER AND METHOD OF MANUFACTURE=


==Organization Name==

[[:Category:Telefonaktiebolaget LM Ericsson (publ)|Telefonaktiebolaget LM Ericsson (publ)]]


[[Category:Telefonaktiebolaget LM Ericsson (publ)]]

==Inventor(s)==

[[:Category:Gabriele De Angelis of Pisa (IT)|Gabriele De Angelis of Pisa (IT)]][[Category:Gabriele De Angelis of Pisa (IT)]]

[[:Category:Stefano Tirelli of Pisa (IT)|Stefano Tirelli of Pisa (IT)]][[Category:Stefano Tirelli of Pisa (IT)]]

[[:Category:Marco Romagnoli of Pisa (IT)|Marco Romagnoli of Pisa (IT)]][[Category:Marco Romagnoli of Pisa (IT)]]

[[:Category:Alessandra Bigongiari of Pisa (IT)|Alessandra Bigongiari of Pisa (IT)]][[Category:Alessandra Bigongiari of Pisa (IT)]]

==PHOTONIC CHIP WITH EDGE COUPLER AND METHOD OF MANUFACTURE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17918505 titled 'PHOTONIC CHIP WITH EDGE COUPLER AND METHOD OF MANUFACTURE

==Simplified Explanation==

The abstract describes a photonic chip that includes a cladding material and an edge coupler. The edge coupler consists of a composite guiding structure made up of multiple parallel planar layers of optical guiding material. These layers extend into the cladding material and are aligned at one edge of the chip. They overlap along a perpendicular axis to the plane of the layers. The chip allows for the deposition of a waveguide on the cladding material, which partially overlaps with one of the layers of the composite guiding structure.

* The photonic chip includes a cladding material and an edge coupler.
* The edge coupler is made up of multiple parallel planar layers of optical guiding material.
* The layers of the composite guiding structure extend into the cladding material and are aligned at one edge of the chip.
* The layers overlap along a perpendicular axis to the plane of the layers.
* The chip allows for the deposition of a waveguide on the cladding material.
* The waveguide partially overlaps with one of the layers of the composite guiding structure.

==Potential Applications==
* Optical communication systems
* Photonic integrated circuits
* Optical sensing devices
* Quantum computing

==Problems Solved==
* Efficient coupling of light into and out of the photonic chip
* Enhanced performance and functionality of photonic devices
* Integration of multiple optical components on a single chip

==Benefits==
* Improved light transmission and manipulation
* Compact and miniaturized optical devices
* Higher data transfer rates and bandwidth
* Increased sensitivity and accuracy in optical sensing


==Original Abstract Submitted==

A photonic chip is disclosed that comprises a cladding material and an edge coupler. The edge coupler comprises a composite guiding structure that comprises a plurality of substantially parallel planar layers of optical guiding material. Each layer of the composite guiding structure extends into the cladding material, wherein each layer is aligned at a first edge of the photonic chip. The layers overlap along a first axis which is perpendicular to a plane of the planar layers of optical guiding material. The photonic chip is arranged for deposition of a waveguide on the cladding material, the waveguide being arranged to at least partially overlap along the first axis with a layer of the composite guiding structure.



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