View source for 17893968. SEMICONDUCTOR DEVICE ASSEMBLY SUBSTRATES WITH TUNNELED INTERCONNECTS, AND METHODS FOR MAKING THE SAME simplified abstract (Micron Technology, Inc.)

=SEMICONDUCTOR DEVICE ASSEMBLY SUBSTRATES WITH TUNNELED INTERCONNECTS, AND METHODS FOR MAKING THE SAME=


==Organization Name==

[[:Category:Micron Technology, Inc.|Micron Technology, Inc.]]


[[Category:Micron Technology, Inc.]]

==Inventor(s)==

[[:Category:Yun Ting Hsu of Taichung (TW)|Yun Ting Hsu of Taichung (TW)]][[Category:Yun Ting Hsu of Taichung (TW)]]

[[:Category:Chong Leong Gan of Taichung (TW)|Chong Leong Gan of Taichung (TW)]][[Category:Chong Leong Gan of Taichung (TW)]]

[[:Category:Min Hua Chung of Taichung (TW)|Min Hua Chung of Taichung (TW)]][[Category:Min Hua Chung of Taichung (TW)]]

[[:Category:Yung Sheng Zou of Taichung (TW)|Yung Sheng Zou of Taichung (TW)]][[Category:Yung Sheng Zou of Taichung (TW)]]

==SEMICONDUCTOR DEVICE ASSEMBLY SUBSTRATES WITH TUNNELED INTERCONNECTS, AND METHODS FOR MAKING THE SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17893968 titled 'SEMICONDUCTOR DEVICE ASSEMBLY SUBSTRATES WITH TUNNELED INTERCONNECTS, AND METHODS FOR MAKING THE SAME

==Simplified Explanation==

The patent application describes a semiconductor device assembly with a package substrate having a tunneled interconnect structure, a semiconductor device disposed over the substrate, and a solder joint coupling the device and the substrate.

* The package substrate has a solder-wettable surface, an interior cavity, and at least one microvia extending from the surface to the cavity.
* The solder joint between the semiconductor device and the interconnect structure includes the solder on the surface, in the microvia, and within the interior cavity.

== Potential Applications ==
* Semiconductor manufacturing
* Electronics industry
* Integrated circuit packaging

== Problems Solved ==
* Improved electrical connections
* Enhanced reliability of semiconductor devices
* Efficient heat dissipation

== Benefits ==
* Higher performance of semiconductor devices
* Increased durability and longevity
* Enhanced functionality of electronic products


==Original Abstract Submitted==

A semiconductor device assembly is provided. The assembly includes a package substrate which has a tunneled interconnect structure. The tunneled interconnect structure has a solder-wettable surface, an interior cavity, and at least one microvia extending from the surface to the cavity. The assembly further includes a semiconductor device disposed over the substrate and a solder joint coupling the device and the substrate. The joint comprises the solder between the semiconductor device and the interconnect structure, which includes the solder on the surface, the solder in the microvia, and the solder within the interior cavity.



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