View source for 17886278. ALTERNATING HIGH K LAYERS ON GLASS PILLARS FOR SUPER CAPACITORS ON GLASS SUBSTRATES simplified abstract (Intel Corporation)

=ALTERNATING HIGH K LAYERS ON GLASS PILLARS FOR SUPER CAPACITORS ON GLASS SUBSTRATES=


==Organization Name==

[[:Category:Intel Corporation|Intel Corporation]]


[[Category:Intel Corporation]]

==Inventor(s)==

[[:Category:Brandon C. Marin of Gilbert AZ (US)|Brandon C. Marin of Gilbert AZ (US)]][[Category:Brandon C. Marin of Gilbert AZ (US)]]

[[:Category:Srinivas V. Pietambaram of Chandler AZ (US)|Srinivas V. Pietambaram of Chandler AZ (US)]][[Category:Srinivas V. Pietambaram of Chandler AZ (US)]]

[[:Category:Gang Duan of Chandler AZ (US)|Gang Duan of Chandler AZ (US)]][[Category:Gang Duan of Chandler AZ (US)]]

[[:Category:Suddhasattwa Nad of Chandler AZ (US)|Suddhasattwa Nad of Chandler AZ (US)]][[Category:Suddhasattwa Nad of Chandler AZ (US)]]

[[:Category:Jeremy D. Ecton of Gilbert AZ (US)|Jeremy D. Ecton of Gilbert AZ (US)]][[Category:Jeremy D. Ecton of Gilbert AZ (US)]]

[[:Category:Rahul N. Manepalli of Chandler AZ (US)|Rahul N. Manepalli of Chandler AZ (US)]][[Category:Rahul N. Manepalli of Chandler AZ (US)]]

==ALTERNATING HIGH K LAYERS ON GLASS PILLARS FOR SUPER CAPACITORS ON GLASS SUBSTRATES - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17886278 titled 'ALTERNATING HIGH K LAYERS ON GLASS PILLARS FOR SUPER CAPACITORS ON GLASS SUBSTRATES

==Simplified Explanation==

* Electronic package with glass substrate, pillar, and capacitor
* Capacitor includes first conductive layer, dielectric layer, and second conductive layer
* Simplified explanation: The patent application describes an electronic package with a glass substrate, a pillar, and a capacitor consisting of multiple layers.

== Potential Applications ==
* Electronics industry for various devices
* Integrated circuits
* Sensors

== Problems Solved ==
* Providing a stable and reliable electronic package
* Ensuring proper functioning of the capacitor
* Enhancing performance of electronic devices

== Benefits ==
* Improved durability and longevity of electronic packages
* Enhanced electrical performance
* Increased efficiency in electronic devices


==Original Abstract Submitted==

Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises a substrate, where the substrate comprises glass. In an embodiment, a pillar is over the substrate, and a capacitor is over the pillar. In an embodiment, the capacitor comprises a first conductive layer on the pillar, a dielectric layer over the first conductive layer, and a second conductive layer over the dielectric layer.



[[Category:H01L23/522]]
[[Category:H01L49/02]]
[[Category:H01G11/70]]
[[Category:H01L23/15]]