View source for 17823189. DIE EDGE FILLET AND 3D-PRINTED CNT AS BENDING STRESS BUFFER simplified abstract (Micron Technology, Inc.)

=DIE EDGE FILLET AND 3D-PRINTED CNT AS BENDING STRESS BUFFER=


==Organization Name==

[[:Category:Micron Technology, Inc.|Micron Technology, Inc.]]


[[Category:Micron Technology, Inc.]]

==Inventor(s)==

[[:Category:Chen Yu Huang of Taichung City (TW)|Chen Yu Huang of Taichung City (TW)]][[Category:Chen Yu Huang of Taichung City (TW)]]

[[:Category:Chong Leong Gan of Taichung City (TW)|Chong Leong Gan of Taichung City (TW)]][[Category:Chong Leong Gan of Taichung City (TW)]]

==DIE EDGE FILLET AND 3D-PRINTED CNT AS BENDING STRESS BUFFER - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17823189 titled 'DIE EDGE FILLET AND 3D-PRINTED CNT AS BENDING STRESS BUFFER

==Simplified Explanation==

The abstract describes a semiconductor package with a fillet, including a trace, solder mask, first die, first adhesive, second die, and second adhesive.

* The semiconductor package has a trace within a solder mask, with a first die mechanically coupled to the trace.
* A fillet is present adjacent to the die edge, with a second die above the first die.
* A cavity is defined by the solder mask top surface, first die surface, and second adhesive bottom surface, with the fillet within the cavity at the die edge.

== Potential Applications ==
* Semiconductor packaging industry
* Electronics manufacturing

== Problems Solved ==
* Improved mechanical coupling between components
* Enhanced protection for semiconductor devices

== Benefits ==
* Increased reliability of semiconductor packages
* Better performance and durability of electronic devices


==Original Abstract Submitted==

A semiconductor package having a fillet is provided. The semiconductor package includes a trace disposed within a solder mask that has a top surface. A first die is over the solder mask and mechanically couples with the trace. A first adhesive is between the trace and the first die where sides of the first die and the first adhesive define a die edge. The semiconductor package includes a fillet adjacent the die edge and a second die above the first die. The semiconductor package also includes a second adhesive having a bottom surface where the second adhesive is between the first die and the second die. The solder mask top surface, the first die surface, and the second adhesive bottom surface define a cavity where the fillet is within the cavity at the die edge.



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