View source for 17816502. DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL ROUTING, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS simplified abstract (QUALCOMM Incorporated)

=DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL ROUTING, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS=


==Organization Name==

[[:Category:QUALCOMM Incorporated|QUALCOMM Incorporated]]


[[Category:QUALCOMM Incorporated]]

==Inventor(s)==

[[:Category:Aniket Patil of San Diego CA (US)|Aniket Patil of San Diego CA (US)]][[Category:Aniket Patil of San Diego CA (US)]]

[[:Category:Hong Bok We of San Diego CA (US)|Hong Bok We of San Diego CA (US)]][[Category:Hong Bok We of San Diego CA (US)]]

[[:Category:Joan Rey Villarba Buot of Escondido CA (US)|Joan Rey Villarba Buot of Escondido CA (US)]][[Category:Joan Rey Villarba Buot of Escondido CA (US)]]

==DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL ROUTING, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17816502 titled 'DEEP TRENCH CAPACITORS (DTCs) EMPLOYING BYPASS METAL TRACE SIGNAL ROUTING, AND RELATED INTEGRATED CIRCUIT (IC) PACKAGES AND FABRICATION METHODS

==Simplified Explanation==

The patent application describes a technology called Deep Trench Capacitors (DTCs) that utilize bypass metal trace signal routing to support signal bypass routing in integrated circuit (IC) packages. The DTC includes an outer metallization layer, such as a redistribution layer (RDL), which serves as an external interface to the DTC.

Key points of the patent/innovation:

* The outer metallization layer of the DTC includes additional metal interconnects that are not coupled to the capacitors in the DTC.
* These additional metal interconnects are interconnected to each other by metal traces (metal lines) in the outer metallization layer of the DTC.
* This configuration provides bypass signal routes through the DTC, allowing signal routes to extend through the capacitor.
* Unlike traditional signal paths in a package substrate, where the DTC is coupled or embedded and requires routing around it, this technology allows for simplified signal routing through the DTC.

Potential applications of this technology:

* Integrated circuit packages: The technology can be applied in various IC packages to improve signal routing efficiency and reduce complexity.
* High-speed communication systems: The bypass signal routes provided by the DTC can enhance signal integrity and reduce signal loss, making it suitable for high-speed communication applications.

Problems solved by this technology:

* Complex signal routing: Traditional methods of routing signals around the DTC in package substrates can be time-consuming and result in increased complexity. This technology simplifies signal routing by providing bypass routes through the DTC.
* Signal loss and degradation: By allowing signals to pass through the DTC instead of routing around it, this technology reduces signal loss and degradation, improving overall signal integrity.

Benefits of this technology:

* Improved signal integrity: The bypass signal routes provided by the DTC help maintain signal quality and reduce signal loss, leading to improved overall system performance.
* Simplified signal routing: By eliminating the need for complex routing around the DTC, this technology simplifies the design and manufacturing process of integrated circuit packages.
* Enhanced efficiency: The use of bypass signal routes through the DTC improves signal transmission efficiency, especially in high-speed communication systems.


==Original Abstract Submitted==

Deep trench capacitors (DTCs) employing bypass metal trace signal routing supporting signal bypass routing, and related integrated circuit (IC) packages and fabrication methods are disclosed. The DTC includes an outer metallization layer (e.g., a redistribution layer (RDL)) to provide an external interface to the DTC. In exemplary aspects, to make available signal routes that can extend through a DTC, an outer metallization layer of the DTC includes additional metal interconnects. These additional metal interconnects are not coupled the capacitors in the DTC. These additional metal interconnects are interconnected to each other by metal traces (e.g., metal lines) in the outer metallization layer of the DTC to provide bypass signal routes through the DTC. This is opposed to signal paths in a package substrate in which the DTC is coupled or embedded having to be routed around the DTC in the package substrate.



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