View source for 17669914. SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

=SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME=


==Organization Name==

[[:Category:Taiwan Semiconductor Manufacturing Co., Ltd.|Taiwan Semiconductor Manufacturing Co., Ltd.]]


[[Category:Taiwan Semiconductor Manufacturing Co., Ltd.]]

==Inventor(s)==

[[:Category:Yen-Chu Tu of Kaohsiung City (TW)|Yen-Chu Tu of Kaohsiung City (TW)]][[Category:Yen-Chu Tu of Kaohsiung City (TW)]]

[[:Category:Shang-Lun Tsai of Hsinchu City (TW)|Shang-Lun Tsai of Hsinchu City (TW)]][[Category:Shang-Lun Tsai of Hsinchu City (TW)]]

[[:Category:Monsen Liu of Hsinchu County (TW)|Monsen Liu of Hsinchu County (TW)]][[Category:Monsen Liu of Hsinchu County (TW)]]

[[:Category:Shuo-Mao Chen of New Taipei City (TW)|Shuo-Mao Chen of New Taipei City (TW)]][[Category:Shuo-Mao Chen of New Taipei City (TW)]]

[[:Category:Shin-Puu Jeng of Po-Shan Village (TW)|Shin-Puu Jeng of Po-Shan Village (TW)]][[Category:Shin-Puu Jeng of Po-Shan Village (TW)]]

==SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17669914 titled 'SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR FORMING THE SAME

==Simplified Explanation==

The abstract describes a semiconductor package structure that includes various components such as a carrier substrate, an interposer substrate, connecting element, semiconductor devices, underfill layer, and package layer.

* The semiconductor package structure consists of a carrier substrate, interposer substrate, connecting element, semiconductor devices, underfill layer, and package layer.
* The interposer substrate is placed on the carrier substrate, and the connecting element is embedded within it.
* The connecting element comprises a dielectric element and conductive features.
* The first semiconductor device and the second semiconductor device are positioned on the interposer substrate.
* The first semiconductor device is connected to the second semiconductor device through the connecting element.
* A first underfill layer is present between the semiconductor devices and the interposer substrate.
* The package layer surrounds the semiconductor devices and the underfill layer.

== Potential Applications ==
* This semiconductor package structure can be used in various electronic devices such as smartphones, tablets, computers, and other consumer electronics.
* It can also be utilized in industrial applications, automotive electronics, and medical devices.

== Problems Solved ==
* The semiconductor package structure provides a compact and efficient way to connect and package multiple semiconductor devices.
* It solves the problem of interconnecting different semiconductor devices within a single package.
* The underfill layer helps in improving the mechanical strength and thermal performance of the package.

== Benefits ==
* The semiconductor package structure offers improved electrical connectivity between semiconductor devices.
* It allows for a higher level of integration and miniaturization of electronic devices.
* The underfill layer enhances the reliability and durability of the package.
* The compact design of the structure enables better heat dissipation and thermal management.


==Original Abstract Submitted==

A semiconductor package structure is provided. The semiconductor package structure includes a carrier substrate, an interposer substrate, a connecting element, a first semiconductor device, a second semiconductor device, a first underfill layer, and a package layer. The interposer substrate is disposed on the carrier substrate. The connecting element is disposed in the interposer substrate. The connecting element includes a dielectric element and first conductive features disposed in the dielectric element. The first semiconductor device and the second semiconductor device are disposed on the interposer substrate. The first semiconductor device is electrically connected to the second semiconductor device through the connecting element. The first underfill layer is disposed between the first semiconductor device, the second semiconductor device, and the interposer substrate. The package layer surrounds the first semiconductor device, the second semiconductor device, and the first underfill layer.



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