View source for 17654907. Dicing Process in Packages Comprising Organic Interposers simplified abstract (TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.)

=Dicing Process in Packages Comprising Organic Interposers=


==Organization Name==

[[:Category:TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.|TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.]]


[[Category:TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.]]

==Inventor(s)==

[[:Category:Chipta Priya Laksana of Taoyuan City (TW)|Chipta Priya Laksana of Taoyuan City (TW)]][[Category:Chipta Priya Laksana of Taoyuan City (TW)]]

[[:Category:Chun-Lung Jao of Shuili Township (TW)|Chun-Lung Jao of Shuili Township (TW)]][[Category:Chun-Lung Jao of Shuili Township (TW)]]

[[:Category:Shu-Shen Yeh of Taoyuan City (TW)|Shu-Shen Yeh of Taoyuan City (TW)]][[Category:Shu-Shen Yeh of Taoyuan City (TW)]]

[[:Category:Chien-Sheng Chen of Hsinchu (TW)|Chien-Sheng Chen of Hsinchu (TW)]][[Category:Chien-Sheng Chen of Hsinchu (TW)]]

[[:Category:Shin-Puu Jeng of Hsinchu (TW)|Shin-Puu Jeng of Hsinchu (TW)]][[Category:Shin-Puu Jeng of Hsinchu (TW)]]

==Dicing Process in Packages Comprising Organic Interposers - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17654907 titled 'Dicing Process in Packages Comprising Organic Interposers

==Simplified Explanation==

The patent application describes a method for forming an interconnect component with multiple dielectric layers and redistribution lines. It also includes bonding package components, encapsulating them, and precutting the interconnect component to form a trench. The singulation process is then performed to separate the package components into individual packages.

* The method involves forming an interconnect component with multiple dielectric layers and redistribution lines.
* The interconnect component is bonded with package components and encapsulated in an encapsulant.
* A trench is formed by precutting the interconnect component using a blade, penetrating through the component and partially into the encapsulant.
* The singulation process is performed to separate the package components into individual packages.

== Potential Applications ==
This technology can be applied in various industries and applications, including:

* Semiconductor manufacturing
* Electronics packaging
* Integrated circuit assembly

== Problems Solved ==
The method described in the patent application addresses several challenges in the manufacturing and assembly processes, such as:

* Ensuring proper interconnection between package components
* Efficiently separating individual packages from a larger component
* Maintaining the integrity and functionality of the interconnect component during singulation

== Benefits ==
The use of this technology offers several benefits, including:

* Improved interconnectivity and reliability of package components
* Enhanced efficiency and accuracy in the singulation process
* Cost savings in manufacturing and assembly processes


==Original Abstract Submitted==

A method includes forming an interconnect component including a plurality of dielectric layers that include an organic dielectric material, and a plurality of redistribution lines extending into the plurality of dielectric layers. The method further includes bonding a first package component and a second package component to the interconnect component, encapsulating the first package component and the second package component in an encapsulant, and precutting the interconnect component using a blade to form a trench. The trench penetrates through the interconnect component, and partially extends into the encapsulant. The method further includes performing a singulation process to separate the first package component and the second package component into a first package and a second package, respectively.



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