View source for 17629358. MANUFACTURING METHOD OF METAL GRID, THIN FILM SENSOR AND MANUFACTURING METHOD OF THIN FILM SENSOR simplified abstract (BOE TECHNOLOGY GROUP CO., LTD.)

=MANUFACTURING METHOD OF METAL GRID, THIN FILM SENSOR AND MANUFACTURING METHOD OF THIN FILM SENSOR=


==Organization Name==

[[:Category:BOE TECHNOLOGY GROUP CO., LTD.|BOE TECHNOLOGY GROUP CO., LTD.]]


[[Category:BOE TECHNOLOGY GROUP CO., LTD.]]

==Inventor(s)==

[[:Category:Hu Meng of Beijing (CN)|Hu Meng of Beijing (CN)]][[Category:Hu Meng of Beijing (CN)]]

==MANUFACTURING METHOD OF METAL GRID, THIN FILM SENSOR AND MANUFACTURING METHOD OF THIN FILM SENSOR - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17629358 titled 'MANUFACTURING METHOD OF METAL GRID, THIN FILM SENSOR AND MANUFACTURING METHOD OF THIN FILM SENSOR

==Simplified Explanation==

The manufacturing method described in the patent application involves creating a metal grid on a base substrate using a specific process. Here is a simplified explanation of the abstract:

* A base substrate is provided.
* A pattern is formed on the base substrate using a first dielectric layer, creating a lattice-shaped groove.
* A second dielectric layer is deposited on the first dielectric layer, covering the sidewalls of the groove and creating a second lattice-shaped groove.
* A metal material is then formed in the second groove.
* Part of the second dielectric layer is removed, ensuring that the metal material and the remaining second dielectric layer do not overlap when projected onto the base substrate.
* This process results in the formation of a metal grid.

Potential applications of this technology:

* Solar panels: The metal grid can be used as a conductive grid in solar panels, improving their efficiency.
* Touchscreens: The metal grid can be used in touchscreens to enhance touch sensitivity and accuracy.
* Printed circuit boards: The metal grid can be applied to printed circuit boards to improve electrical conductivity.

Problems solved by this technology:

* Improved conductivity: The metal grid enhances the conductivity of the substrate, allowing for better performance in various applications.
* Precision patterning: The process ensures precise patterning of the metal grid, resulting in a high-quality product.
* Avoiding overlap: By removing part of the second dielectric layer, the patent addresses the issue of potential overlap between the metal material and the dielectric layer.

Benefits of this technology:

* Enhanced performance: The metal grid improves the performance of devices by providing better conductivity.
* Cost-effective manufacturing: The manufacturing method described in the patent application allows for efficient and cost-effective production of metal grids.
* Versatility: The metal grid can be applied to various substrates and used in different applications, making it a versatile solution.


==Original Abstract Submitted==

A manufacturing method of a metal grid includes: providing a base substrate; forming a pattern including a first dielectric layer on the base substrate through a patterning process such that the first dielectric layer has a first groove in a lattice shape; forming a second dielectric layer on a side of the first dielectric layer away from the base substrate such that the second dielectric layer is deposited at least on a sidewall of the first groove to form a second groove in a lattice shape; and forming a metal material in the second groove, and removing at least a part of a material of the second dielectric layer such that an orthographic projection of the part of the material of the second dielectric layer on the base substrate does not overlap with an orthographic projection of the metal material on the base substrate, to form a metal grid.



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