View source for 17567497. PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE simplified abstract (Taiwan Semiconductor Manufacturing Co., Ltd.)

=PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE=


==Organization Name==

[[:Category:Taiwan Semiconductor Manufacturing Co., Ltd.|Taiwan Semiconductor Manufacturing Co., Ltd.]]


[[Category:Taiwan Semiconductor Manufacturing Co., Ltd.]]

==Inventor(s)==

[[:Category:Chung-Ming Weng of Hsinchu (TW)|Chung-Ming Weng of Hsinchu (TW)]][[Category:Chung-Ming Weng of Hsinchu (TW)]]

[[:Category:Chen-Hua Yu of Hsinchu (TW)|Chen-Hua Yu of Hsinchu (TW)]][[Category:Chen-Hua Yu of Hsinchu (TW)]]

[[:Category:Chung-Shi Liu of Hsinchu (TW)|Chung-Shi Liu of Hsinchu (TW)]][[Category:Chung-Shi Liu of Hsinchu (TW)]]

[[:Category:Hao-Yi Tsai of Hsinchu (TW)|Hao-Yi Tsai of Hsinchu (TW)]][[Category:Hao-Yi Tsai of Hsinchu (TW)]]

[[:Category:Cheng-Chieh Hsieh of Tainan (TW)|Cheng-Chieh Hsieh of Tainan (TW)]][[Category:Cheng-Chieh Hsieh of Tainan (TW)]]

[[:Category:Hung-Yi Kuo of Taipei (TW)|Hung-Yi Kuo of Taipei (TW)]][[Category:Hung-Yi Kuo of Taipei (TW)]]

[[:Category:Tsung-Yuan Yu of Taipei (TW)|Tsung-Yuan Yu of Taipei (TW)]][[Category:Tsung-Yuan Yu of Taipei (TW)]]

[[:Category:Hua-Kuei Lin of Hsinchu (TW)|Hua-Kuei Lin of Hsinchu (TW)]][[Category:Hua-Kuei Lin of Hsinchu (TW)]]

[[:Category:Che-Hsiang Hsu of Hsinchu (TW)|Che-Hsiang Hsu of Hsinchu (TW)]][[Category:Che-Hsiang Hsu of Hsinchu (TW)]]

==PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE - A simplified explanation of the abstract==


This abstract first appeared for US patent application 17567497 titled 'PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

==Simplified Explanation==

The patent application describes a package that includes a photonic layer on a substrate, an interconnect structure, an electronic die, and a first dielectric layer. It also includes a socket and a fiber holder that re-orients the optical path of an optical signal.

* The package includes a photonic layer with a silicon waveguide coupled to a grating coupler.
* An interconnect structure is placed over the photonic layer.
* An electronic die is connected to the interconnect structure.
* A first dielectric layer is placed over the interconnect structure and electronic die.
* A first substrate is bonded to the electronic die and the first dielectric layer.
* A socket is attached to the top surface of the first substrate.
* A fiber holder is coupled to the first substrate through the socket.
* The fiber holder includes a prism that re-orients the optical path of an optical signal.

== Potential Applications ==
* Optical communication systems
* Data centers
* Telecommunications networks
* Fiber optic networks

== Problems Solved ==
* Efficient coupling of optical signals into the photonic layer
* Re-orienting the optical path of an optical signal
* Integration of electronic and photonic components

== Benefits ==
* Improved performance and efficiency of optical communication systems
* Simplified packaging and integration of electronic and photonic components
* Enhanced signal transmission and reception in fiber optic networks


==Original Abstract Submitted==

A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.



[[Category:G02B6/43]]
[[Category:G02B6/42]]