SEARCH RESULTS for assignor:"WONG, KWAI HONG"

Showing 1 to 3 of 3 results

Last Update Patent(s) Assignor(s) Orig. Assignee(s) Assignee(s) Reel/Frame
10-May-2018

(X0) 1: Substrate Based Fan-Out Wafer Level Packaging

(A1) 2: Substrate Based Fan-Out Wafer Level Packaging

TAN, KIM HENG

CHAI, CHAN WAH

WONG, KWAI HONG

UNISEM (M) BERHAD

40383/663

10-May-2018

(X0) 1: Substrate Based Fan-Out Wafer Level Packaging

(A1) 2: Substrate Based Fan-Out Wafer Level Packaging

TAN, KIM HENG

CHAI, CHAN WAH

WONG, KWAI HONG

UNISEM (M) BERHAD

43040/750

10-May-2018

(X0) 1: Substrate Based Fan-Out Wafer Level Packaging

(A1) 2: Substrate Based Fan-Out Wafer Level Packaging

TAN, KIM HENG

CHAI, CHAN WAH

WONG, KWAI HONG

UNISEM (M) BERHAD

43266/915