SEARCH RESULTS for assignor:"TSENG, CHUN-HAO"

Showing 1 to 8 of 8 results

Last Update Patent(s) Assignor(s) Orig. Assignee(s) Assignee(s) Reel/Frame
17-May-2018

(X0) 1: Package and Method for Integration of Heterogeneous Integrated Circuits

(A1) 2: Package and Method for Integration of Heterogeneous Integrated Circuits

LEE, WAN-YU

TSENG, CHUN-HAO

LAI, JUI HSIEH

HUANG, TIEN-YU

KUO, YING-HAO

YEE, KUO-CHUNG

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

44491/731

01-May-2018

(X0) 1: THERMALLY CONDUCTIVE MOLDING COMPOUND STRUCTURE FOR HEAT DISSIPATION IN SEMICONDUCTOR PACKAGES

(A1) 2: THERMALLY CONDUCTIVE MOLDING COMPOUND STRUCTURE FOR HEAT DISSIPATION IN SEMICONDUCTOR PACKAGES

(B2) 9: THERMALLY CONDUCTIVE MOLDING COMPOUND STRUCTURE FOR HEAT DISSIPATION IN SEMICONDUCTOR PACKAGES

TSENG, CHUN-HAO

KUO, YING-HAO

YEE, KUO-CHUNG

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

31576/30

29-Mar-2018

(X0) 1: METHOD FOR FORMING SEMICONDUCTOR PACKAGE USING CARBON NANO MATERIAL IN MOLDING COMPOUND

(A1) 2: METHOD FOR FORMING SEMICONDUCTOR PACKAGE USING CARBON NANO MATERIAL IN MOLDING COMPOUND

TSENG, CHUN-HAO

KUO, YING-HAO

YEE, KUO-CHUNG

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

44232/707

29-Mar-2018

(X0) 1: METHOD TO FABRICATE MASK-PELLICLE SYSTEM

(A1) 2: METHOD TO FABRICATE MASK-PELLICLE SYSTEM

TSENG, CHUN-HAO

CHIN, SHENG-CHI

CHU, YUAN-CHIH

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

44300/484

06-Mar-2018

(X0) 1: METHOD OF FABRICATION POLYMER WAVEGUIDE

(A1) 2: METHOD OF FABRICATION POLYMER WAVEGUIDE

(B2) 9: METHOD OF FABRICATION POLYMER WAVEGUIDE

TSENG, CHUN-HAO

LEE, WAN-YU

CHEN, HAI-CHING

BAO, TIEN-I

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

36004/226

27-Feb-2018

(X0) 1: VACUUM CARRIER MODULE, METHOD OF USING AND PROCESS OF MAKING THE SAME

(A1) 2: VACUUM CARRIER MODULE, METHOD OF USING AND PROCESS OF MAKING THE SAME

(B2) 9: VACUUM CARRIER MODULE, METHOD OF USING AND PROCESS OF MAKING THE SAME

HUANG, TIEN-YU

TSENG, CHUN-HAO

KUO, YING-HAO

YEE, KUO-CHUNG

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

31772/92

09-Jan-2018

(X0) 1: PACKAGE AND METHOD FOR INTEGRATION OF HETEROGENEOUS INTEGRATED CIRCUITS

(A1) 2: PACKAGE AND METHOD FOR INTEGRATION OF HETEROGENEOUS INTEGRATED CIRCUITS

(B2) 9: PACKAGE AND METHOD FOR INTEGRATION OF HETEROGENEOUS INTEGRATED CIRCUITS

LEE, WAN-YU

TSENG, CHUN-HAO

LAI, JUI HSIEH

HUANG, TIEN-YU

KUO, YING-HAO

YEE, KUO-CHUNG

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

39292/135

02-Jan-2018

(X0) 1: METHOD FOR FORMING SEMICONDUCTOR PACKAGE USING CARBON NANO MATERIAL IN MOLDING COMPOUND

(A1) 2: METHOD FOR FORMING SEMICONDUCTOR PACKAGE USING CARBON NANO MATERIAL IN MOLDING COMPOUND

(B2) 9: METHOD FOR FORMING SEMICONDUCTOR PACKAGE USING CARBON NANO MATERIAL IN MOLDING COMPOUND

TSENG, CHUN-HAO

KUO, YING-HAO

YEE, KUO-CHUNG

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

31808/380