SEARCH RESULTS for assignor:"LIN, CHIN-HSIANG"

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(X0) 15628261: HARDMASK COMPOSITION AND METHODS THEREOF

(A1) 20180174831: HARDMASK COMPOSITION AND METHODS THEREOF

(B2) 1: HARDMASK COMPOSITION AND METHODS THEREOF

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(X0) 15595525: Patterning Process with Silicon Mask Layer

(A1) 20180174828: Patterning Process with Silicon Mask Layer

(B2) 1: Patterning Process with Silicon Mask Layer

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Patent(s)

(X0) 15628261: HARDMASK COMPOSITION AND METHODS THEREOF

(A1) 20180174831: HARDMASK COMPOSITION AND METHODS THEREOF

(B2) 1: HARDMASK COMPOSITION AND METHODS THEREOF

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(X0) 15480976: METHOD FOR FORMING SEMICONDUCTOR STRUCTURE USING MODIFIED RESIST LAYER

(A1) 20180292752: METHOD FOR FORMING SEMICONDUCTOR STRUCTURE USING MODIFIED RESIST LAYER

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(X0) 15468109: UNDER LAYER COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

(B1) 1: UNDER LAYER COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

(A1) 20180277359: UNDER LAYER COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

(B2) 1: UNDER LAYER COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

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(X0) 15685908: Semiconductor Method of Protecting Wafer from Bevel Contamination

(B1) 1: Semiconductor Method of Protecting Wafer from Bevel Contamination

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(X0) 13314850: METHOD AND SYSTEM FOR TOOL CONDITION MONITORING BASED ON A SIMULATED INLINE MEASUREMENT

(A1) 20130150997: METHOD AND SYSTEM FOR TOOL CONDITION MONITORING BASED ON A SIMULATED INLINE MEASUREMENT

(B2) 1: METHOD AND SYSTEM FOR TOOL CONDITION MONITORING BASED ON A SIMULATED INLINE MEASUREMENT

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(X0) 15395310: Directional Patterning Methods

(A1) 20180090370: Directional Patterning Methods

(B2) 1: Directional Patterning Methods

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(X0) 15412856: Extreme Ultraviolet Photoresist and Method

(A1) 20180149971: Extreme Ultraviolet Photoresist and Method

(B2) 1: Extreme Ultraviolet Photoresist and Method

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(X0) 15380911: MATERIAL COMPOSITION AND PROCESS FOR SUBSTRATE MODIFICATION

(A1) 20180174837: MATERIAL COMPOSITION AND PROCESS FOR SUBSTRATE MODIFICATION

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(X0) 15474522: Pattern Fidelity Enhancement with Directional Patterning Technology

(A1) 20180174853: Pattern Fidelity Enhancement with Directional Patterning Technology

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(A1) 20180173096: Extreme Ultraviolet Photolithography Method With Developer Composition

(X0) 15617300: Extreme Ultraviolet Photolithography Method With Developer Composition

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(X0) 15614032: Extreme Ultraviolet Photoresist With High-Efficiency Electron Transfer

(A1) 20180173101: Extreme Ultraviolet Photoresist With High-Efficiency Electron Transfer

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(X0) 15621646: Material Composition and Methods Thereof

(A1) 20180177055: Material Composition and Methods Thereof

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(X0) 15621646: Material Composition and Methods Thereof

(A1) 20180177055: Material Composition and Methods Thereof

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(X0) 15474522: Pattern Fidelity Enhancement with Directional Patterning Technology

(A1) 20180174853: Pattern Fidelity Enhancement with Directional Patterning Technology

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(X0) 15628355: MATERIAL COMPOSITION AND METHODS THEREOF

(A1) 20180174830: MATERIAL COMPOSITION AND METHODS THEREOF

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(X0) 15482315: RESIST MATERIAL AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE USING RESIST LAYER

(A1) 20180164684: RESIST MATERIAL AND METHOD FOR FORMING SEMICONDUCTOR STRUCTURE USING RESIST LAYER

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(X0) 15697226: Lithography Process With Enhanced Etch Selectivity

(A1) 20180149976: Lithography Process With Enhanced Etch Selectivity

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(X0) 15723582: Photoresist with Gradient Composition for Improved Uniformity

(A1) 20180151351: Photoresist with Gradient Composition for Improved Uniformity