SEARCH RESULTS for assignor:"LAVOIE, ADRIEN"

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(X0) 15955099: ATOMIC LAYER ETCH, REACTIVE PRECURSORS AND ENERGETIC SOURCES FOR PATTERNING APPLICATIONS

(A1) 20180308695: ATOMIC LAYER ETCH, REACTIVE PRECURSORS AND ENERGETIC SOURCES FOR PATTERNING APPLICATIONS

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(X0) 15461417: SYSTEMS AND METHODS FOR FLOW MONITORING IN A PRECURSOR VAPOR SUPPLY SYSTEM OF A SUBSTRATE PROCESSING SYSTEM

(A1) 20180265983: SYSTEMS AND METHODS FOR FLOW MONITORING IN A PRECURSOR VAPOR SUPPLY SYSTEM OF A SUBSTRATE PROCESSING SYSTEM

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(X0) 15253546: HIGH DRY ETCH RATE MATERIALS FOR SEMICONDUCTOR PATTERNING APPLICATIONS

(A1) 20180061650: HIGH DRY ETCH RATE MATERIALS FOR SEMICONDUCTOR PATTERNING APPLICATIONS

(B2) 1: HIGH DRY ETCH RATE MATERIALS FOR SEMICONDUCTOR PATTERNING APPLICATIONS

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(X0) 15201221: SELECTIVE ATOMIC LAYER DEPOSITION WITH POST-DOSE TREATMENT

(A1) 20180005814: SELECTIVE ATOMIC LAYER DEPOSITION WITH POST-DOSE TREATMENT

(B2) 1: SELECTIVE ATOMIC LAYER DEPOSITION WITH POST-DOSE TREATMENT

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(X0) 15253301: SELECTIVE ATOMIC LAYER DEPOSITION FOR GAPFILL USING SACRIFICIAL UNDERLAYER

(A1) 20180061628: SELECTIVE ATOMIC LAYER DEPOSITION FOR GAPFILL USING SACRIFICIAL UNDERLAYER

(B2) 1: SELECTIVE ATOMIC LAYER DEPOSITION FOR GAPFILL USING SACRIFICIAL UNDERLAYER

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(X0) 15385813: CONICAL WAFER CENTERING AND HOLDING DEVICE FOR SEMICONDUCTOR PROCESSING

(A1) 20180171473: CONICAL WAFER CENTERING AND HOLDING DEVICE FOR SEMICONDUCTOR PROCESSING

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(X0) 14194549: CAPPED ALD FILMS FOR DOPING FIN-SHAPED CHANNEL REGIONS OF 3-D IC TRANSISTORS

(A1) 20160379826: CAPPED ALD FILMS FOR DOPING FIN-SHAPED CHANNEL REGIONS OF 3-D IC TRANSISTORS

(B2) 9: CAPPED ALD FILMS FOR DOPING FIN-SHAPED CHANNEL REGIONS OF 3-D IC TRANSISTORS

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(X0) 15089960: SYSTEMS AND METHODS FOR FREQUENCY MODULATION OF RADIOFREQUENCY POWER SUPPLY FOR CONTROLLING PLASMA INSTABILITY

(A1) 20170141002: SYSTEMS AND METHODS FOR FREQUENCY MODULATION OF RADIOFREQUENCY POWER SUPPLY FOR CONTROLLING PLASMA INSTABILITY

(B2) 9: SYSTEMS AND METHODS FOR FREQUENCY MODULATION OF RADIOFREQUENCY POWER SUPPLY FOR CONTROLLING PLASMA INSTABILITY

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(X0) 15582359: ATOMIC LAYER ETCH METHODS AND HARDWARE FOR PATTERNING APPLICATIONS

(B1) 9: ATOMIC LAYER ETCH METHODS AND HARDWARE FOR PATTERNING APPLICATIONS

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(X0) 14798652: SYSTEMS AND METHODS FOR VAPOR DELIVERY IN A SUBSTRATE PROCESSING SYSTEM

(A1) 20160032453: SYSTEMS AND METHODS FOR VAPOR DELIVERY IN A SUBSTRATE PROCESSING SYSTEM

(B2) 9: SYSTEMS AND METHODS FOR VAPOR DELIVERY IN A SUBSTRATE PROCESSING SYSTEM

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(X0) 15431088: PLANAR SUBSTRATE EDGE CONTACT WITH OPEN VOLUME EQUALIZATION PATHWAYS AND SIDE CONTAINMENT

(A1) 20180122685: PLANAR SUBSTRATE EDGE CONTACT WITH OPEN VOLUME EQUALIZATION PATHWAYS AND SIDE CONTAINMENT

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(X0) 14805807: VALVE MANIFOLD DEADLEG ELIMINATION VIA REENTRANT FLOW PATH

(A1) 20160147234: VALVE MANIFOLD DEADLEG ELIMINATION VIA REENTRANT FLOW PATH

(B2) 9: VALVE MANIFOLD DEADLEG ELIMINATION VIA REENTRANT FLOW PATH

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(X0) 15263838: SYSTEMS AND METHODS FOR REDUCING EFFLUENT BUILD-UP IN A PUMPING EXHAUST SYSTEM

(A1) 20180073137: SYSTEMS AND METHODS FOR REDUCING EFFLUENT BUILD-UP IN A PUMPING EXHAUST SYSTEM

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(X0) 15224347: PLASMA ASSISTED ATOMIC LAYER DEPOSITION OF MULTI-LAYER FILMS FOR PATTERNING APPLICATIONS

(A1) 20160336178: PLASMA ASSISTED ATOMIC LAYER DEPOSITION OF MULTI-LAYER FILMS FOR PATTERNING APPLICATIONS

(B2) 9: PLASMA ASSISTED ATOMIC LAYER DEPOSITION OF MULTI-LAYER FILMS FOR PATTERNING APPLICATIONS

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(X0) 15279312: DOPED ALD FILMS FOR SEMICONDUCTOR PATTERNING APPLICATIONS

(A1) 20180033622: DOPED ALD FILMS FOR SEMICONDUCTOR PATTERNING APPLICATIONS