SEARCH RESULTS for assignor:"LAI, CHIH-MING"

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(X0) 15605934: COVER BODY THAT FIXES A LIGHT GUIDE BAR AND ENHANCES THE STRUCTURAL STRENGTH OF THE COVERED CONNECTOR

(A1) 20180294606: COVER BODY THAT FIXES A LIGHT GUIDE BAR AND ENHANCES THE STRUCTURAL STRENGTH OF THE COVERED CONNECTOR

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(X0) 15616930: HEAT DISSIPATER RESILIENT STRUCTURE AND CONNECTOR MODULE

(A1) 20180295710: HEAT DISSIPATER RESILIENT STRUCTURE AND CONNECTOR MODULE

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(X0) 15179754: Multiple Patterning Method for Semiconductor Devices

(A1) 20170193147: Multiple Patterning Method for Semiconductor Devices

(B2) 1: Multiple Patterning Method for Semiconductor Devices

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(X0) 15362002: METHOD OF MANUFACTURING FINS AND SEMICONDUCTOR DEVICE WHICH INCLUDES FINS

(A1) 20170317089: METHOD OF MANUFACTURING FINS AND SEMICONDUCTOR DEVICE WHICH INCLUDES FINS

(B2) 1: METHOD OF MANUFACTURING FINS AND SEMICONDUCTOR DEVICE WHICH INCLUDES FINS

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(X0) 15898882: POWER STRAP STRUCTURE FOR HIGH PERFORMANCE AND LOW CURRENT DENSITY

(A1) 20180174967: POWER STRAP STRUCTURE FOR HIGH PERFORMANCE AND LOW CURRENT DENSITY

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(X0) 15689244: MULTIPLE PATTERNING DECOMPOSITION AND MANUFACTURING METHODS FOR IC

(A1) 20180164695: MULTIPLE PATTERNING DECOMPOSITION AND MANUFACTURING METHODS FOR IC

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(A1) 20180166431: SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF THE SAME

(X0) 15699990: SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF THE SAME

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(X0) 15455146: LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE

(A1) 20180158999: LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING LIGHT-EMITTING DEVICE

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(X0) 15598516: High-Density Semiconductor Device

(A1) 20180151551: High-Density Semiconductor Device

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(X0) 15611896: Self Aligned Via and Method for Fabricating the Same

(A1) 20180151432: Self Aligned Via and Method for Fabricating the Same

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(X0) 15676225: METHOD OF MANUFACTURING CONDUCTORS AND SEMICONDUCTOR DEVICE WHICH INCLUDES CONDUCTORS

(A1) 20180151552: METHOD OF MANUFACTURING CONDUCTORS AND SEMICONDUCTOR DEVICE WHICH INCLUDES CONDUCTORS

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(X0) 15852129: Methods for Integrated Circuit Design and Fabrication

(A1) 20180138042: Methods for Integrated Circuit Design and Fabrication

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(X0) 15674521: INTERFACE CARD FIXING DEVICE AND MAIN BOARD MODULE

(A1) 20180102600: INTERFACE CARD FIXING DEVICE AND MAIN BOARD MODULE

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(X0) 15655877: APPARATUS FOR COVERING CONNECTION PORT ASSEMBLY

(B1) 9: APPARATUS FOR COVERING CONNECTION PORT ASSEMBLY

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(X0) 15258932: SYSTEM FOR AND METHOD OF MANUFACTURING A LAYOUT DESIGN OF AN INTEGRATED CIRCUIT

(A1) 20180068050: SYSTEM FOR AND METHOD OF MANUFACTURING A LAYOUT DESIGN OF AN INTEGRATED CIRCUIT

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(X0) 15143842: POWER STRAP STRUCTURE FOR HIGH PERFORMANCE AND LOW CURRENT DENSITY

(A1) 20170317027: POWER STRAP STRUCTURE FOR HIGH PERFORMANCE AND LOW CURRENT DENSITY

(B2) 9: POWER STRAP STRUCTURE FOR HIGH PERFORMANCE AND LOW CURRENT DENSITY

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(X0) 14970242: Via Connection to a Partially Filled Trench

(A1) 20170170110: Via Connection to a Partially Filled Trench

(B2) 9: Via Connection to a Partially Filled Trench

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(X0) 15229536: METHOD OF ADJUSTING METAL LINE PITCH

(A1) 20180039723: METHOD OF ADJUSTING METAL LINE PITCH

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(X0) 15229536: METHOD OF ADJUSTING METAL LINE PITCH

(A1) 20180039723: METHOD OF ADJUSTING METAL LINE PITCH