SEARCH RESULTS for assignor:"CHUNG, CHOON MYUN"

Recent Patent Assignments Patent Assignments - (Total found: 792)

Last Update Patent(s) Assignor(s) Orig. Assignee(s) Assignee(s) Reel/Frame
17-May-2018

(X0) 1: FAN FRAME BODY WITH BYPASS STRUCTURE AND FAN THEREOF

(A1) 2: FAN FRAME BODY WITH BYPASS STRUCTURE AND FAN THEREOF

CHANG, BOR-HAW

CHEN, YU-TZU

WANG, CHUNG-SHU

ASIA VITAL COMPONENTS CO., LTD.

40299/563

17-May-2018

(X0) 1: HEAT DISSIPATION FAN BLADE STRUCTURE AND HEAT DISSIPATION FAN THEREOF

(A1) 2: HEAT DISSIPATION FAN BLADE STRUCTURE AND HEAT DISSIPATION FAN THEREOF

CHEN, YU-TZU

WANG, CHUNG-SHU

ASIA VITAL COMPONENTS CO., LTD.

40299/557

17-May-2018

(X0) 1: SEMICONDUCTOR DEVICE PACKAGE STRUCTURE

(A1) 2: SEMICONDUCTOR DEVICE PACKAGE STRUCTURE

FANG, YU-AN

CHEN, YING-CHUNG

HUANG, CHENG-LING

ADVANCED SEMICONDUCTOR ENGINEERING, INC.

40313/766

17-May-2018

(X0) 1: ELECTROSTATIC DISCHARGE (ESD) PROTECTION DEVICE AND METHOD FABRICATING THE ESD PROTECTION DEVICE

(A1) 2: ELECTROSTATIC DISCHARGE (ESD) PROTECTION DEVICE AND METHOD FABRICATING THE ESD PROTECTION DEVICE

HUANG, CHUNG-YU

CHANG, PING-CHEN

CHIU, HOU-JEN

UNITED MICROELECTRONICS CORP.

40347/232

17-May-2018

(X0) 1: MEMORY DEVICE AND METHOD OF FABRICATING THEREOF

(A1) 2: MEMORY DEVICE AND METHOD OF FABRICATING THEREOF

LIN, JING-RU

SHU, CHENG-BO

YANG, TSUNG-YU

HUANG, CHUNG-JEN

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

40356/546

17-May-2018

(X0) 1: Reduced Memory Nucleotide Sequence Comparison

(A1) 2: Reduced Memory Nucleotide Sequence Comparison

LO, DANIEL

CHUNG, ERIC

OVTCHAROV, KALIN

PANDYA, RAVINDRA

HECKERMAN, DAVID

SNYTSAR, ROMAN

MICROSOFT TECHNOLOGY LICENSING LLC

40365/674

17-May-2018

(X0) 1: Customized Integrated Circuit For Serial Performance Of Smith Waterman Analysis

(A1) 2: Customized Integrated Circuit For Serial Performance Of Smith Waterman Analysis

LO, DANIEL

CHUNG, ERIC

OVTCHAROV, KALIN

PANDYA, RAVINDRA

HECKERMAN, DAVID

MICROSOFT TECHNOLOGY LICENSING LLC

40365/793

17-May-2018

(X0) 1: MICROELECTRONIC DEVICE PACKAGE HAVING ALTERNATELY STACKED DIE

(A1) 2: MICROELECTRONIC DEVICE PACKAGE HAVING ALTERNATELY STACKED DIE

CHEAH, BOK ENG

LIM, MIN SUET

KONG, JACKSON CHUNG PENG

INTEL CORPORATION

40393/374

17-May-2018

(X0) 1: PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF

(A1) 2: PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF

CHEN, CHIH-LIN

TSAI, CHUNG-HAO

HSIEH, JENG-SHIEN

WANG, CHUEI-TANG

YU, CHEN-HUA

CHANG, CHIH-YUAN

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

40406/467

17-May-2018

(X0) 1: INTERCONNECT STRUCTURE INCLUDING AIR GAP

(A1) 2: INTERCONNECT STRUCTURE INCLUDING AIR GAP

YANG, TAI-I

CHU, WEI-CHEN

CHEN, HSIN-PING

LU, CHIH-WEI

LEE, CHUNG-JU

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

40413/709

17-May-2018

(X0) 1: WIRELESS DEVICE AND RANDOM ACCESS METHOD THEREOF FOR MOBILE COMMUNICATION SYSTEM

(A1) 2: WIRELESS DEVICE AND RANDOM ACCESS METHOD THEREOF FOR MOBILE COMMUNICATION SYSTEM

WU, MING-JU

CHUNG, CHUNG-HSIU

INSTITUTE FOR INFORMATION INDUSTRY

40456/143

17-May-2018

(X0) 1: SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF

(A1) 2: SEMICONDUCTOR DEVICE AND FORMING METHOD THEREOF

LI, CHUNG-TING

LU, JEN-HSIANG

CHANG, CHIH-HAO

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

40487/896

17-May-2018

(X0) 1: COLLECTION COMPONENT AND SAMPLE PROCESSING KIT HAVING THE SAME

(A1) 2: COLLECTION COMPONENT AND SAMPLE PROCESSING KIT HAVING THE SAME

WO, ANDREW MAN CHUNG

CHEN, CHEN-LIN

YANG, CHENG-WEI

HSU, WEI-FAN

NATIONAL TAIWAN UNIVERSITY

40817/670

17-May-2018

(X0) 1: INTELLIGENT DIAGNOSIS SYSTEM FOR POWER MODULE AND METHOD THEREOF

(A1) 2: INTELLIGENT DIAGNOSIS SYSTEM FOR POWER MODULE AND METHOD THEREOF

CHIU, CHIH-CHUNG

TZENG, CHIH-MING

LIAO, LI-LING

CHAO, YU-LIN

SHEN, CHIH-MING

LIANG, MING-KAAN

LIU, CHUN-KAI

DAI, MING-JI

INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

41147/665

17-May-2018

(X0) 1: FIRE SCENE EVACUATION GUIDING DEVICE

(A1) 2: FIRE SCENE EVACUATION GUIDING DEVICE

YANG, CHUNG-SHU

LAI, ALEXANDER I-CHI

NEXCOM INTERNATIONAL CO., LTD.

41509/16

17-May-2018

(X0) 1: THERMAL DISSIPATION DEVICE AND SEMICONDUCTOR PACKAGE DEVICE INCLUDING THE SAME

(A1) 2: THERMAL DISSIPATION DEVICE AND SEMICONDUCTOR PACKAGE DEVICE INCLUDING THE SAME

CHIU, PIN HUNG

CHUNG, YU LI

SU, SHU LING

LIN, YI TZU

ADVANCED SEMICONDUCTOR ENGINEERING, INC.

41533/207

17-May-2018

(X0) 1: Amphiphilic Film Structure Having Hydrophilic and Hydrophobic Properties

(A1) 2: Amphiphilic Film Structure Having Hydrophilic and Hydrophobic Properties

CHUNG, YI-CHANG

WU, KAI-MING

41616/313

17-May-2018

(X0) 1: COOLING FAN AND ELECTRONIC DEVICE HAVING THE SAME

(A1) 2: COOLING FAN AND ELECTRONIC DEVICE HAVING THE SAME

CHUNG, MING-HSIU

TAI, YU-KAI

FOXCONN TECHNOLOGY CO., LTD.

41748/290

17-May-2018

(X0) 1: REPLAYING SYSTEM AND REPLAYING METHOD

(A1) 2: REPLAYING SYSTEM AND REPLAYING METHOD

LIU, MING-YUAN

CHENG, AN-CHI

HSU, HUAN-CHUNG

41803/685

17-May-2018

(X0) 1: CHARACTER STRING RECOGNITION METHOD AND MACHINE LEARNING METHOD

(A1) 2: CHARACTER STRING RECOGNITION METHOD AND MACHINE LEARNING METHOD

CHEN, CHUNG-CHIANG

JUANG, JIA-YU

PENG, SHAO-LIANG

WU, TE-YI

41934/764