SEARCH RESULTS for assignor:"CHOU, YOU-HUA"

Showing 1 to 7 of 7 results

Last Update Patent(s) Assignor(s) Orig. Assignee(s) Assignee(s) Reel/Frame
14-Jun-2018

(X0) 15889450: METHOD OF FORMING CONDUCTIVE BUMPS FOR COOLING DEVICE CONNECTION

(A1) 20180166361: METHOD OF FORMING CONDUCTIVE BUMPS FOR COOLING DEVICE CONNECTION

CHOU, YOU-HUA

LAI, YI-JEN

CHEN, CHUN-JEN

KAO, PERRE

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

44840/656

29-May-2018

(X0) 13439127: SHOWER HEAD APPARATUS AND METHOD FOR CONTROLLIGN PLASMA OR GAS DISTRIBUTION

(A1) 20130267045: SHOWER HEAD APPARATUS AND METHOD FOR CONTROLLIGN PLASMA OR GAS DISTRIBUTION

(B2) 9: SHOWER HEAD APPARATUS AND METHOD FOR CONTROLLIGN PLASMA OR GAS DISTRIBUTION

LEE, CHIH-TSUNG

CHANG, HUNG-JUI

CHOU, YOU-HUA

JANGJIAN, SHUI-KO

KAO, CHUNG-EN

TSAI, MING-CHIN

LAI, HUAN-WEN

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

28253/15

29-May-2018

(X0) 14212890: Barrier Structure for Copper Interconnect

(A1) 20150262938: Barrier Structure for Copper Interconnect

(B2) 9: Barrier Structure for Copper Interconnect

LIN, YU-HUNG

YEH, CHING-FU

CHANG, YU-MIN

CHOU, YOU-HUA

CHANG, CHIH-WEI

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY

33041/115

22-May-2018

(X0) 13460884: SEMICONDUCTOR FILM FORMATION APPARATUS AND PROCESS

(A1) 20130295297: SEMICONDUCTOR FILM FORMATION APPARATUS AND PROCESS

(B2) 9: SEMICONDUCTOR FILM FORMATION APPARATUS AND PROCESS

CHOU, YOU-HUA

LEE, CHIH-TSUNG

WU, SHU-FEN

LIN, CHIN-HSIANG

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

28391/187

20-Feb-2018

(X0) 14593617: METHOD OF FORMING CONDUCTIVE BUMPS FOR COOLING DEVICE CONNECTION

(A1) 20150125998: METHOD OF FORMING CONDUCTIVE BUMPS FOR COOLING DEVICE CONNECTION

(B2) 9: METHOD OF FORMING CONDUCTIVE BUMPS FOR COOLING DEVICE CONNECTION

CHOU, YOU-HUA

LAI, YI-JEN

CHEN, CHUN-JEN

KAO, PERRE

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

34675/503

13-Feb-2018

(X0) 14220708: WAFER PROCESSING SYSTEM USING MULTI-ZONE CHUCK

(A1) 20140202383: WAFER PROCESSING SYSTEM USING MULTI-ZONE CHUCK

(B2) 9: WAFER PROCESSING SYSTEM USING MULTI-ZONE CHUCK

CHENG, NAI-HAN

YANG, CHI-MING

CHOU, YOU-HUA

CHUANG, KUO-SHENG

LIN, CHIN-HSIANG

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

32487/692

09-Jan-2018

(X0) 14589091: SHIELDING DESIGN FOR METAL GAP FILL

(A1) 20150118843: SHIELDING DESIGN FOR METAL GAP FILL

(B2) 9: SHIELDING DESIGN FOR METAL GAP FILL

TSAI, MING-CHIN

LIN, BO-HUNG

CHOU, YOU-HUA

KAO, CHUNG-EN

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

34839/976