SEARCH RESULTS for assignor:"CHEN, HO-PING"

Showing 1 to 3 of 3 results

Last Update Patent(s) Assignor(s) Orig. Assignee(s) Assignee(s) Reel/Frame
28-Aug-2018

(X0) 15182348: PATTERNING METHOD AND PATTERNING APPARATUS FOR FABRICATING A RESIST PATTERN

(A1) 20170277044: PATTERNING METHOD AND PATTERNING APPARATUS FOR FABRICATING A RESIST PATTERN

(B2) 1: PATTERNING METHOD AND PATTERNING APPARATUS FOR FABRICATING A RESIST PATTERN

LEE, YUNG-YAO

PENG, JUI-CHUN

CHEN, HO-PING

LIU, HENG-HSIN

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

38912/506

22-May-2018

(X0) 15170459: SEMICONDUCTOR METHOD AND ASSOCIATED APPARATUS

(A1) 20170352564: SEMICONDUCTOR METHOD AND ASSOCIATED APPARATUS

(B2) 9: SEMICONDUCTOR METHOD AND ASSOCIATED APPARATUS

LEE, YUNG-YAO

PENG, JUI-CHUN

CHEN, HO-PING

LIU, HENG-HSIN

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

38961/194

09-Jan-2018

(X0) 14486514: WAFER ALIGNMENT MARK SCHEME

(A1) 20150002846: WAFER ALIGNMENT MARK SCHEME

(B2) 9: WAFER ALIGNMENT MARK SCHEME

TSENG, WEI-HSIANG

LIN, CHIN-HSIANG

LIU, HENG-HSIN

PENG, JUI-CHUN

CHEN, HO-PING

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

33741/694