SEARCH RESULTS for assignor:"CHANG, CHIH-YUAN"

Showing 1 to 3 of 3 results

Last Update Patent(s) Assignor(s) Orig. Assignee(s) Assignee(s) Reel/Frame
31-May-2018

(X0) 1: HEAT TRANSFER STRUCTURES AND METHODS FOR IC PACKAGES

(A1) 2: HEAT TRANSFER STRUCTURES AND METHODS FOR IC PACKAGES

HSU, YING-CHIH

ROTH, ALAN

WANG, CHUEI-TANG

CHANG, CHIH-YUAN

SOENEN, ERIC

CHEN, CHIH-LIN

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

43092/67

17-May-2018

(X0) 1: PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF

(A1) 2: PACKAGE STRUCTURE AND METHOD OF FORMING THEREOF

CHEN, CHIH-LIN

TSAI, CHUNG-HAO

HSIEH, JENG-SHIEN

WANG, CHUEI-TANG

YU, CHEN-HUA

CHANG, CHIH-YUAN

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

40406/467

13-Feb-2018

(X0) 1: SEMICONDUCTOR DEVICE AND METHOD

(A1) 2: SEMICONDUCTOR DEVICE AND METHOD

(B2) 9: SEMICONDUCTOR DEVICE AND METHOD

CHANG, CHIH-YUAN

YU, CHEN-HUA

WANG, CHUEI-TANG

HSIEH, JENG-SHIEN

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

38480/982