SEARCH RESULTS for assignor:"BITZ, BRADLEY R."

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(X0) 15345973: SEMICONDUCTOR DIE ASSEMBLIES HAVING MOLDED UNDERFILL STRUCTURES AND RELATED TECHNOLOGY

(A1) 20180130773: SEMICONDUCTOR DIE ASSEMBLIES HAVING MOLDED UNDERFILL STRUCTURES AND RELATED TECHNOLOGY

(B2) 1: SEMICONDUCTOR DIE ASSEMBLIES HAVING MOLDED UNDERFILL STRUCTURES AND RELATED TECHNOLOGY

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(X0) 15181212: Semiconductor device assembly with through-mold cooling channel formed in encapsulant

(A1) 20170358556: Semiconductor device assembly with through-mold cooling channel formed in encapsulant

(B2) 9: Semiconductor device assembly with through-mold cooling channel formed in encapsulant