SEARCH RESULTS for assignor:"BITZ, BRADLEY R."

Showing 1 to 2 of 2 results

Last Update Patent(s) Assignor(s) Orig. Assignee(s) Assignee(s) Reel/Frame
10-May-2018

(X0) 15345973: SEMICONDUCTOR DIE ASSEMBLIES HAVING MOLDED UNDERFILL STRUCTURES AND RELATED TECHNOLOGY

(A1) 20180130773: SEMICONDUCTOR DIE ASSEMBLIES HAVING MOLDED UNDERFILL STRUCTURES AND RELATED TECHNOLOGY

BITZ, BRADLEY R.

LI, XIAO

MICRON TECHNOLOGY, INC.

41020/31

01-May-2018

(X0) 15181212: Semiconductor device assembly with through-mold cooling channel formed in encapsulant

(A1) 20170358556: Semiconductor device assembly with through-mold cooling channel formed in encapsulant

(B2) 9: Semiconductor device assembly with through-mold cooling channel formed in encapsulant

BITZ, BRADLEY R.

LI, XIAO

MICRON TECHNOLOGY, INC.

38909/914