SEARCH RESULTS for assignee:"ASIA VITAL COMPONENTS CO., LTD."

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(X0) 15415882: CAMERA MODULE WITH INTEGRATED CHIP-ON-BOARD IMAGE SENSING CHIP

(A1) 20180213129: CAMERA MODULE WITH INTEGRATED CHIP-ON-BOARD IMAGE SENSING CHIP

(B2) 1: CAMERA MODULE WITH INTEGRATED CHIP-ON-BOARD IMAGE SENSING CHIP

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(X0) 15629757: HEAT DISSIPATION DEVICE

(A1) 20180372431: HEAT DISSIPATION DEVICE

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(X0) 15629759: METHOD OF MANUFACTURING A HEAT DISSIPATION DEVICE

(A1) 20180369971: METHOD OF MANUFACTURING A HEAT DISSIPATION DEVICE

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(X0) 15633711: BEARING STRUCTURE WITH CLOSE FIT

(A1) 20180372156: BEARING STRUCTURE WITH CLOSE FIT

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(X0) 15792993: Heat Dissipation Device

(A1) 20180372418: Heat Dissipation Device

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(X0) 15792997: METHOD OF MANUFACTURING A HEAT DISSIPATION DEVICE

(A1) 20180369896: METHOD OF MANUFACTURING A HEAT DISSIPATION DEVICE

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(X0) 16033170: CASE HEAT DISSIPATION UNIT OF HANDHELD ELECTRONIC DEVICE

(A1) 20180376619: CASE HEAT DISSIPATION UNIT OF HANDHELD ELECTRONIC DEVICE

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(X0) 16058994: BACK COVER UNIT APPLIED TO HANDHELD ELECTRONIC DEVICE WITH HEAT CONDUCTION AND HEAT DISSIPATION EFFECT

(A1) 20180376620: BACK COVER UNIT APPLIED TO HANDHELD ELECTRONIC DEVICE WITH HEAT CONDUCTION AND HEAT DISSIPATION EFFECT