SEARCH RESULTS for assignee:"APPLIED MATERIALS, INC."

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(X0) 14464633: POLISHING PAD CONFIGURATION AND CHEMICAL MECHANICAL POLISHING SYSTEM

(A1) 20160016282: POLISHING PAD CONFIGURATION AND CHEMICAL MECHANICAL POLISHING SYSTEM

(B2) 1: POLISHING PAD CONFIGURATION AND CHEMICAL MECHANICAL POLISHING SYSTEM

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(X0) 14501902: FILAMENT TEMPERATURE DERIVATION IN HOTWIRE SEMICONDUCTOR PROCESS

(A1) 20150112631: FILAMENT TEMPERATURE DERIVATION IN HOTWIRE SEMICONDUCTOR PROCESS

(B2) 1: FILAMENT TEMPERATURE DERIVATION IN HOTWIRE SEMICONDUCTOR PROCESS

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(X0) 14315794: SUBSTRATE SUPPORT RING FOR MORE UNIFORM LAYER THICKNESS

(A1) 20150020736: SUBSTRATE SUPPORT RING FOR MORE UNIFORM LAYER THICKNESS

(B2) 1: SUBSTRATE SUPPORT RING FOR MORE UNIFORM LAYER THICKNESS

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(X0) 14612263: INLINE DPS CHAMBER HARDWARE DESIGN TO ENABLE AXIS SYMMETRY FOR IMPROVED FLOW CONDUCTANCE AND UNIFORMITY

(A1) 20150218697: INLINE DPS CHAMBER HARDWARE DESIGN TO ENABLE AXIS SYMMETRY FOR IMPROVED FLOW CONDUCTANCE AND UNIFORMITY

(B2) 1: INLINE DPS CHAMBER HARDWARE DESIGN TO ENABLE AXIS SYMMETRY FOR IMPROVED FLOW CONDUCTANCE AND UNIFORMITY

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(X0) 15046270: DETERMINATION OF GAIN FOR EDDY CURRENT SENSOR

(A1) 20160158908: DETERMINATION OF GAIN FOR EDDY CURRENT SENSOR

(B2) 1: DETERMINATION OF GAIN FOR EDDY CURRENT SENSOR

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(X0) 15167740: SYSTEM AND METHOD FOR MANUFACTURING PLANARIZED EXTREME ULTRAVIOLET LITHOGRAPHY BLANK

(A1) 20160274454: SYSTEM AND METHOD FOR MANUFACTURING PLANARIZED EXTREME ULTRAVIOLET LITHOGRAPHY BLANK

(B2) 1: SYSTEM AND METHOD FOR MANUFACTURING PLANARIZED EXTREME ULTRAVIOLET LITHOGRAPHY BLANK

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(X0) 15334431: ADVANCED COATING METHOD AND MATERIALS TO PREVENT HDP-CVD CHAMBER ARCING

(A1) 20170159176: ADVANCED COATING METHOD AND MATERIALS TO PREVENT HDP-CVD CHAMBER ARCING

(B2) 1: ADVANCED COATING METHOD AND MATERIALS TO PREVENT HDP-CVD CHAMBER ARCING

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(X0) 15334431: ADVANCED COATING METHOD AND MATERIALS TO PREVENT HDP-CVD CHAMBER ARCING

(A1) 20170159176: ADVANCED COATING METHOD AND MATERIALS TO PREVENT HDP-CVD CHAMBER ARCING

(B2) 1: ADVANCED COATING METHOD AND MATERIALS TO PREVENT HDP-CVD CHAMBER ARCING

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(X0) 15104461: SOURCE RF POWER SPLIT INNER COIL TO IMPROVE BCD AND ETCH DEPTH PERFORMANCE

(A1) 20170200585: SOURCE RF POWER SPLIT INNER COIL TO IMPROVE BCD AND ETCH DEPTH PERFORMANCE

(B2) 1: SOURCE RF POWER SPLIT INNER COIL TO IMPROVE BCD AND ETCH DEPTH PERFORMANCE

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(X0) 15840900: METHOD OF RECONSTITUTED SUBSTRATE FORMATION FOR ADVANCED PACKAGING APPLICATIONS

(A1) 20180374718: METHOD OF RECONSTITUTED SUBSTRATE FORMATION FOR ADVANCED PACKAGING APPLICATIONS

(B2) 1: METHOD OF RECONSTITUTED SUBSTRATE FORMATION FOR ADVANCED PACKAGING APPLICATIONS

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(X0) 16000431: Methods Of Lowering Wordline Resistance

(A1) 20180350606: Methods Of Lowering Wordline Resistance

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(X0) 15882454: ACCOMMODATING IMPERFECTLY ALIGNED MEMORY HOLES

(A1) 20180226425: ACCOMMODATING IMPERFECTLY ALIGNED MEMORY HOLES

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(X0) 15671909: MULTI-PLATE FACEPLATE FOR A PROCESSING CHAMBER

(A1) 20190051499: MULTI-PLATE FACEPLATE FOR A PROCESSING CHAMBER

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(X0) 15585842: FLUORESCENCE BASED THERMOMETRY FOR PACKAGING APPLICATIONS

(A1) 20180323092: FLUORESCENCE BASED THERMOMETRY FOR PACKAGING APPLICATIONS

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(X0) 15847339: SHOWERHEAD AND PROCESS CHAMBER INCORPORATING SAME

(A1) 20190048467: SHOWERHEAD AND PROCESS CHAMBER INCORPORATING SAME

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(X0) 15879371: Microwave Reactor For Deposition or Treatment of Carbon Compounds

(A1) 20190051495: Microwave Reactor For Deposition or Treatment of Carbon Compounds

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(X0) 15675457: TEMPERATURE CONTROL FOR ADDITIVE MANUFACTURING

(A1) 20190047226: TEMPERATURE CONTROL FOR ADDITIVE MANUFACTURING

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(X0) 16121844: SUBSTRATE SUPPORT WITH SYMMETRICAL FEED STRUCTURE

(A1) 20190051551: SUBSTRATE SUPPORT WITH SYMMETRICAL FEED STRUCTURE

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(X0) 16059608: DISTRIBUTED ELECTRODE ARRAY FOR PLASMA PROCESSING

(A1) 20190051496: DISTRIBUTED ELECTRODE ARRAY FOR PLASMA PROCESSING

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(X0) 16154330: METHOD FOR GRADED ANTI-REFLECTIVE COATINGS BY PHYSICAL VAPOR DEPOSITION

(A1) 20190051768: METHOD FOR GRADED ANTI-REFLECTIVE COATINGS BY PHYSICAL VAPOR DEPOSITION