SEARCH RESULTS for assignee:"APPLIED MATERIALS, INC."
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(X0) 14464633: POLISHING PAD CONFIGURATION AND CHEMICAL MECHANICAL POLISHING SYSTEM
(A1) 20160016282: POLISHING PAD CONFIGURATION AND CHEMICAL MECHANICAL POLISHING SYSTEM
(B2) 1: POLISHING PAD CONFIGURATION AND CHEMICAL MECHANICAL POLISHING SYSTEM
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(X0) 14501902: FILAMENT TEMPERATURE DERIVATION IN HOTWIRE SEMICONDUCTOR PROCESS
(A1) 20150112631: FILAMENT TEMPERATURE DERIVATION IN HOTWIRE SEMICONDUCTOR PROCESS
(B2) 1: FILAMENT TEMPERATURE DERIVATION IN HOTWIRE SEMICONDUCTOR PROCESS
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(X0) 14315794: SUBSTRATE SUPPORT RING FOR MORE UNIFORM LAYER THICKNESS
(A1) 20150020736: SUBSTRATE SUPPORT RING FOR MORE UNIFORM LAYER THICKNESS
(B2) 1: SUBSTRATE SUPPORT RING FOR MORE UNIFORM LAYER THICKNESS
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(X0) 14612263: INLINE DPS CHAMBER HARDWARE DESIGN TO ENABLE AXIS SYMMETRY FOR IMPROVED FLOW CONDUCTANCE AND UNIFORMITY
(A1) 20150218697: INLINE DPS CHAMBER HARDWARE DESIGN TO ENABLE AXIS SYMMETRY FOR IMPROVED FLOW CONDUCTANCE AND UNIFORMITY
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(X0) 15046270: DETERMINATION OF GAIN FOR EDDY CURRENT SENSOR
(A1) 20160158908: DETERMINATION OF GAIN FOR EDDY CURRENT SENSOR
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(X0) 15167740: SYSTEM AND METHOD FOR MANUFACTURING PLANARIZED EXTREME ULTRAVIOLET LITHOGRAPHY BLANK
(A1) 20160274454: SYSTEM AND METHOD FOR MANUFACTURING PLANARIZED EXTREME ULTRAVIOLET LITHOGRAPHY BLANK
(B2) 1: SYSTEM AND METHOD FOR MANUFACTURING PLANARIZED EXTREME ULTRAVIOLET LITHOGRAPHY BLANK
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(X0) 15334431: ADVANCED COATING METHOD AND MATERIALS TO PREVENT HDP-CVD CHAMBER ARCING
(A1) 20170159176: ADVANCED COATING METHOD AND MATERIALS TO PREVENT HDP-CVD CHAMBER ARCING
(B2) 1: ADVANCED COATING METHOD AND MATERIALS TO PREVENT HDP-CVD CHAMBER ARCING
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(X0) 15334431: ADVANCED COATING METHOD AND MATERIALS TO PREVENT HDP-CVD CHAMBER ARCING
(A1) 20170159176: ADVANCED COATING METHOD AND MATERIALS TO PREVENT HDP-CVD CHAMBER ARCING
(B2) 1: ADVANCED COATING METHOD AND MATERIALS TO PREVENT HDP-CVD CHAMBER ARCING
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(X0) 15104461: SOURCE RF POWER SPLIT INNER COIL TO IMPROVE BCD AND ETCH DEPTH PERFORMANCE
(A1) 20170200585: SOURCE RF POWER SPLIT INNER COIL TO IMPROVE BCD AND ETCH DEPTH PERFORMANCE
(B2) 1: SOURCE RF POWER SPLIT INNER COIL TO IMPROVE BCD AND ETCH DEPTH PERFORMANCE
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(X0) 15840900: METHOD OF RECONSTITUTED SUBSTRATE FORMATION FOR ADVANCED PACKAGING APPLICATIONS
(A1) 20180374718: METHOD OF RECONSTITUTED SUBSTRATE FORMATION FOR ADVANCED PACKAGING APPLICATIONS
(B2) 1: METHOD OF RECONSTITUTED SUBSTRATE FORMATION FOR ADVANCED PACKAGING APPLICATIONS
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(X0) 16000431: Methods Of Lowering Wordline Resistance
(A1) 20180350606: Methods Of Lowering Wordline Resistance
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(X0) 15882454: ACCOMMODATING IMPERFECTLY ALIGNED MEMORY HOLES
(A1) 20180226425: ACCOMMODATING IMPERFECTLY ALIGNED MEMORY HOLES
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(X0) 15671909: MULTI-PLATE FACEPLATE FOR A PROCESSING CHAMBER
(A1) 20190051499: MULTI-PLATE FACEPLATE FOR A PROCESSING CHAMBER
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(X0) 15585842: FLUORESCENCE BASED THERMOMETRY FOR PACKAGING APPLICATIONS
(A1) 20180323092: FLUORESCENCE BASED THERMOMETRY FOR PACKAGING APPLICATIONS
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(X0) 15847339: SHOWERHEAD AND PROCESS CHAMBER INCORPORATING SAME
(A1) 20190048467: SHOWERHEAD AND PROCESS CHAMBER INCORPORATING SAME
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(X0) 15879371: Microwave Reactor For Deposition or Treatment of Carbon Compounds
(A1) 20190051495: Microwave Reactor For Deposition or Treatment of Carbon Compounds
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(X0) 15675457: TEMPERATURE CONTROL FOR ADDITIVE MANUFACTURING
(A1) 20190047226: TEMPERATURE CONTROL FOR ADDITIVE MANUFACTURING
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(X0) 16121844: SUBSTRATE SUPPORT WITH SYMMETRICAL FEED STRUCTURE
(A1) 20190051551: SUBSTRATE SUPPORT WITH SYMMETRICAL FEED STRUCTURE
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(X0) 16059608: DISTRIBUTED ELECTRODE ARRAY FOR PLASMA PROCESSING
(A1) 20190051496: DISTRIBUTED ELECTRODE ARRAY FOR PLASMA PROCESSING
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(X0) 16154330: METHOD FOR GRADED ANTI-REFLECTIVE COATINGS BY PHYSICAL VAPOR DEPOSITION
(A1) 20190051768: METHOD FOR GRADED ANTI-REFLECTIVE COATINGS BY PHYSICAL VAPOR DEPOSITION
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