SEARCH RESULTS for assignor:KANG, JONG HYUK

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(X0) 15553656: PLASTIC DEFORMATION MAGNESIUM ALLOY HAVING EXCELLENT THERMAL CONDUCTIVITY AND FLAME RETARDANCY, AND PREPARATION METHOD THEREFOR

(A1) 20190112693: PLASTIC DEFORMATION MAGNESIUM ALLOY HAVING EXCELLENT THERMAL CONDUCTIVITY AND FLAME RETARDANCY, AND PREPARATION METHOD THEREFOR

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(X0) 15803865: MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

(A1) 20190115259: MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

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(X0) 15820461: DATA ENCODING METHOD, MEMORY CONTROL CIRCUIT UNIT AND MEMORY STORAGE DEVICE

(A1) 20190114226: DATA ENCODING METHOD, MEMORY CONTROL CIRCUIT UNIT AND MEMORY STORAGE DEVICE

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(X0) 15730969: Microstructure Formulation Techniques for Botulinum Toxin

(A1) 20190111119: Microstructure Formulation Techniques for Botulinum Toxin

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(X0) 15730969: Microstructure Formulation Techniques for Botulinum Toxin

(A1) 20190111119: Microstructure Formulation Techniques for Botulinum Toxin

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(X0) 15823887: SYSTEM AND METHOD OF CONTROLLING AIR CONDITIONING SYSTEM FOR VEHICLE

(A1) 20190111762: SYSTEM AND METHOD OF CONTROLLING AIR CONDITIONING SYSTEM FOR VEHICLE

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(X0) 15905138: POSITION ESTIMATING APPARATUS AND METHOD

(A1) 20190113629: POSITION ESTIMATING APPARATUS AND METHOD

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(X0) 15764034: Apparatus for Generating Sound by Using Car Body

(A1) 20190111840: Apparatus for Generating Sound by Using Car Body

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(X0) 15904876: LIGHT EMITTING DIODE APPARATUS AND MANUFACTURING METHOD THEREOF

(A1) 20190115506: LIGHT EMITTING DIODE APPARATUS AND MANUFACTURING METHOD THEREOF

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(X0) 15955546: DISPLAY DEVICE

(A1) 20190113796: DISPLAY DEVICE

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(X0) 15965730: ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

(A1) 20190115405: ORGANIC LIGHT EMITTING DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME

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(X0) 15964009: MICROFLUIDIC CHIP AND MANUFACTURING METHOD THEREOF AND INTEGRATED MICROFLUIDIC CHIP SYSTEM

(A1) 20190113475: MICROFLUIDIC CHIP AND MANUFACTURING METHOD THEREOF AND INTEGRATED MICROFLUIDIC CHIP SYSTEM

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(X0) 15968143: SEMICONDUCTOR PACKAGE

(A1) 20190115325: SEMICONDUCTOR PACKAGE

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(X0) 15988497: COIL ELECTRONIC COMPONENT

(A1) 20190115145: COIL ELECTRONIC COMPONENT

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(X0) 16008186: AMPLIFIER, AND ANALOG-TO-DIGITAL CONVERSION CIRCUIT AND IMAGE SENSOR INCLUDING THE SAME

(A1) 20190116331: AMPLIFIER, AND ANALOG-TO-DIGITAL CONVERSION CIRCUIT AND IMAGE SENSOR INCLUDING THE SAME

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(X0) 16013988: STORAGE DEVICE HAVING PARAMETER CALIBRATION FUNCTION, AND OPERATING METHOD THEREOF

(A1) 20190115078: STORAGE DEVICE HAVING PARAMETER CALIBRATION FUNCTION, AND OPERATING METHOD THEREOF

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(X0) 15984803: MEMORY CHIP, PACKAGE DEVICE HAVING THE SAME, AND OPERATING METHOD THEREOF

(A1) 20190115052: MEMORY CHIP, PACKAGE DEVICE HAVING THE SAME, AND OPERATING METHOD THEREOF

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(X0) 16075262: Composition Including GDF11 and Use Thereof

(A1) 20190111108: Composition Including GDF11 and Use Thereof

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(X0) 16147604: Light Emitting Diode and Fabrication Method Thereof

(A1) 20190115511: Light Emitting Diode and Fabrication Method Thereof