SEARCH RESULTS for assignor:CLEVENGER, LAWRENCE A

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(X0) 16414336: CO-FABRICATION OF MAGNETIC DEVICE STRUCTURES WITH ELECTRICAL INTERCONNECTS HAVING REDUCED RESISTANCE THROUGH INCREASED CONDUCTOR GRAIN SIZE

(A1) 20190273204: CO-FABRICATION OF MAGNETIC DEVICE STRUCTURES WITH ELECTRICAL INTERCONNECTS HAVING REDUCED RESISTANCE THROUGH INCREASED CONDUCTOR GRAIN SIZE

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(X0) 15882545: BEOL SELF-ALIGNED INTERCONNECT STRUCTURE

(A1) 20190237366: BEOL SELF-ALIGNED INTERCONNECT STRUCTURE

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(X0) 15882301: METHOD AND STRUCTURE TO CONSTRUCT CYLINDRICAL INTERCONNECTS TO REDUCE RESISTANCE

(A1) 20190237402: METHOD AND STRUCTURE TO CONSTRUCT CYLINDRICAL INTERCONNECTS TO REDUCE RESISTANCE

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(X0) 15865530: AUTO-INCORRECT IN CHATBOT HUMAN-MACHINE INTERFACES

(A1) 20190215282: AUTO-INCORRECT IN CHATBOT HUMAN-MACHINE INTERFACES

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(X0) 15867044: DEDICATED CONTACTS FOR CONTROLLED ELECTROFORMING OF MEMORY CELLS IN RESISTIVE RANDOM-ACCESS MEMORY ARRAY

(A1) 20190214558: DEDICATED CONTACTS FOR CONTROLLED ELECTROFORMING OF MEMORY CELLS IN RESISTIVE RANDOM-ACCESS MEMORY ARRAY

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(X0) 15852377: EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY PATTERNING METHODS UTILIZING EUV RESIST HARDENING

(A1) 20190198325: EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY PATTERNING METHODS UTILIZING EUV RESIST HARDENING

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(X0) 15847005: DIELECTRIC GAP FILL EVALUATION FOR INTEGRATED CIRCUITS

(A1) 20190189503: DIELECTRIC GAP FILL EVALUATION FOR INTEGRATED CIRCUITS

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(B2) 10312140: DIELECTRIC GAP FILL EVALUATION FOR INTEGRATED CIRCUITS

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(X0) 16286072: DIELECTRIC GAP FILL EVALUATION FOR INTEGRATED CIRCUITS

(A1) 20190189504: DIELECTRIC GAP FILL EVALUATION FOR INTEGRATED CIRCUITS

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(X0) 15837361: SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP

(A1) 20190181033: SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP

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(X0) 15839505: BACK END OF LINE ELECTRICAL FUSE STRUCTURE AND METHOD OF FABRICATION

(A1) 20190181091: BACK END OF LINE ELECTRICAL FUSE STRUCTURE AND METHOD OF FABRICATION

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(X0) 15829435: CAPACITANCE REDUCTION IN SEA OF LINES BEOL METALLIZATION

(A1) 20190172783: CAPACITANCE REDUCTION IN SEA OF LINES BEOL METALLIZATION

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(X0) 15830204: COGNITIVE SITUATION-AWARE VISION DEFICIENCY REMEDIATION

(A1) 20190172347: COGNITIVE SITUATION-AWARE VISION DEFICIENCY REMEDIATION

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(X0) 15830211: COGNITIVE SITUATION-AWARE VISION DEFICIENCY REMEDIATION

(A1) 20190168668: COGNITIVE SITUATION-AWARE VISION DEFICIENCY REMEDIATION

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(X0) 15830207: COGNITIVE SITUATION-AWARE VISION DEFICIENCY REMEDIATION

(A1) 20190172229: COGNITIVE SITUATION-AWARE VISION DEFICIENCY REMEDIATION

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(X0) 16257221: FORMING SELF-ALIGNED VIAS AND AIR-GAPS IN SEMICONDUCTOR FABRICATION

(A1) 20190172748: FORMING SELF-ALIGNED VIAS AND AIR-GAPS IN SEMICONDUCTOR FABRICATION

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(X0) 15825669: SECURE ACCESS FOR DRONE PACKAGE DELIVERY

(A1) 20190164441: SECURE ACCESS FOR DRONE PACKAGE DELIVERY

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(X0) 15827181: GRANTING REQUESTS FOR AUTHORIZATION USING DATA OF DEVICES ASSOCIATED WITH REQUESTORS

(A1) 20190164163: GRANTING REQUESTS FOR AUTHORIZATION USING DATA OF DEVICES ASSOCIATED WITH REQUESTORS

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(X0) 15816566: COMPUTER-MEDIATED REALITY INCLUDING PHYSICAL DAMPING FEEDBACK

(A1) 20190155236: COMPUTER-MEDIATED REALITY INCLUDING PHYSICAL DAMPING FEEDBACK

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(X0) 15787814: DRONE DELIVERY ROUTING AND COMMUNICATION

(A1) 20190122177: DRONE DELIVERY ROUTING AND COMMUNICATION

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(X0) 15791451: OPTIMIZATING SEMICONDUCTOR BINNING BY FEED-FORWARD PROCESS ADJUSTMENT

(A1) 20190122911: OPTIMIZATING SEMICONDUCTOR BINNING BY FEED-FORWARD PROCESS ADJUSTMENT