SEARCH RESULTS for assignor:CHENG, JUNG-FU

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(X0) 15698812: METHOD FOR PROGRAMMING NON-VOLATILE MEMORY AND MEMORY SYSTEM

(A1) 20190080750: METHOD FOR PROGRAMMING NON-VOLATILE MEMORY AND MEMORY SYSTEM

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(B1) 1: METHOD OF FABRICATING FINS INCLUDING REMOVING DUMMY FINS AFTER FLUOROCARBON FLUSH STEP AND OXYGEN CLEAN STEP

(X0) 15700175: METHOD OF FABRICATING FINS INCLUDING REMOVING DUMMY FINS AFTER FLUOROCARBON FLUSH STEP AND OXYGEN CLEAN STEP

(A1) 20190080968: METHOD OF FABRICATING FINS INCLUDING REMOVING DUMMY FINS AFTER FLUOROCARBON FLUSH STEP AND OXYGEN CLEAN STEP

(B2) 1: METHOD OF FABRICATING FINS INCLUDING REMOVING DUMMY FINS AFTER FLUOROCARBON FLUSH STEP AND OXYGEN CLEAN STEP

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(X0) 15699133: LUBRICATABLE BALL SCREW DEVICE

(A1) 20190078681: LUBRICATABLE BALL SCREW DEVICE

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(X0) 15699350: METHOD FOR PRODUCING THREE-DIMENSIONAL ORDERED POROUS MICROSTRUCTURE AND MONOLITHIC COLUMN PRODUCED THEREBY

(A1) 20190077936: METHOD FOR PRODUCING THREE-DIMENSIONAL ORDERED POROUS MICROSTRUCTURE AND MONOLITHIC COLUMN PRODUCED THEREBY

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(X0) 15699426: SEMICONDUCTOR POWER DEVICE

(A1) 20190081136: SEMICONDUCTOR POWER DEVICE

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(B1) 1: SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

(X0) 15699572: SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

(A1) 20190081042: SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

(B2) 1: SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

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(X0) 15701051: OPTICAL SENSOR PACKAGE MODULE AND MANUFACTURING METHOD THEREOF

(A1) 20190081097: OPTICAL SENSOR PACKAGE MODULE AND MANUFACTURING METHOD THEREOF

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(X0) 15703097: VIA FORMATION USING DIRECTED SELF-ASSEMBLY OF A BLOCK COPOLYMER

(A1) 20190080958: VIA FORMATION USING DIRECTED SELF-ASSEMBLY OF A BLOCK COPOLYMER

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(X0) 15703221: NANOSHEET TRANSISTOR WITH IMPROVED INNER SPACER

(A1) 20190081155: NANOSHEET TRANSISTOR WITH IMPROVED INNER SPACER

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(X0) 15703944: HEAD MOUNTED DISPLAY SYSTEM AND IMAGE DISPLAY METHOD THEREOF

(A1) 20190079288: HEAD MOUNTED DISPLAY SYSTEM AND IMAGE DISPLAY METHOD THEREOF

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(X0) 15704375: HIGH-VOLTAGE SEMICONDUCTOR DEVICE

(A1) 20190081045: HIGH-VOLTAGE SEMICONDUCTOR DEVICE

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(X0) 15699547: NEBULIZER AND NOZZLE ASSEMBLY THEREOF

(A1) 20190076605: NEBULIZER AND NOZZLE ASSEMBLY THEREOF

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(X0) 15729380: Packaging Assembly for High-Speed Vertical-Cavity Surface-Emitting Laser

(A1) 20190081455: Packaging Assembly for High-Speed Vertical-Cavity Surface-Emitting Laser

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(X0) 15784176: OXIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

(A1) 20190081183: OXIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

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(X0) 15794260: PARALLEL-CONNECTED CONDENSER AND COOLING DEVICE USING THE SAME

(A1) 20190078846: PARALLEL-CONNECTED CONDENSER AND COOLING DEVICE USING THE SAME

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(X0) 15699816: SUBSTRATE FOR PACKAGING A SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

(A1) 20190080995: SUBSTRATE FOR PACKAGING A SEMICONDUCTOR DEVICE PACKAGE AND A METHOD OF MANUFACTURING THE SAME

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(X0) 15810120: REFLECTIVE LIQUID CRYSTAL DISPLAY

(A1) 20190079340: REFLECTIVE LIQUID CRYSTAL DISPLAY

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(X0) 15821336: POSITIONING AND MEASURING SYSTEM BASED ON FLEXIBLE FEATURE IMAGE SCALE

(A1) 20190080469: POSITIONING AND MEASURING SYSTEM BASED ON FLEXIBLE FEATURE IMAGE SCALE

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(X0) 15821221: POSITIONING AND MEASURING SYSTEM BASED ON IMAGE SCALE

(A1) 20190080468: POSITIONING AND MEASURING SYSTEM BASED ON IMAGE SCALE

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(X0) 15855221: VACUUM DEPOSITION COMPOSITE TARGET

(A1) 20190080890: VACUUM DEPOSITION COMPOSITE TARGET