SEARCH RESULTS for assignee:"MACOM TECHNOLOGY SOLUTIONS HOLDINGS, INC." AND day:[2019-01-07T00:00:00Z TO 2019-01-07T23:59:59Z]

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(X0) 09792414: GALLIUM NITRIDE MATERIAL DEVICES AND METHODS INCLUDING BACKSIDE VIAS

(A1) 20020117681: GALLIUM NITRIDE MATERIAL DEVICES AND METHODS INCLUDING BACKSIDE VIAS

(B2) 6: GALLIUM NITRIDE MATERIAL DEVICES AND METHODS INCLUDING BACKSIDE VIAS

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(X0) 09792409: GALLIUM NITRIDE MATERIALS INCLUDING THERMALLY CONDUCTIVE REGIONS

(A1) 20020117695: GALLIUM NITRIDE MATERIALS INCLUDING THERMALLY CONDUCTIVE REGIONS

(B2) 6: GALLIUM NITRIDE MATERIALS INCLUDING THERMALLY CONDUCTIVE REGIONS

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(X0) 10650122: GALLIUM NITRIDE MATERIAL DEVICES AND METHODS OF FORMING THE SAME

(A1) 20040130002: GALLIUM NITRIDE MATERIAL DEVICES AND METHODS OF FORMING THE SAME

(B2) 7: GALLIUM NITRIDE MATERIAL DEVICES AND METHODS OF FORMING THE SAME

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(X0) 10740376: GALLIUM NITRIDE MATERIAL DEVICES INCLUDING AN ELECTRODE-DEFINING LAYER AND METHODS OF FORMING THE SAME

(A1) 20050133818: GALLIUM NITRIDE MATERIAL DEVICES INCLUDING AN ELECTRODE-DEFINING LAYER AND METHODS OF FORMING THE SAME

(B2) 7: GALLIUM NITRIDE MATERIAL DEVICES INCLUDING AN ELECTRODE-DEFINING LAYER AND METHODS OF FORMING THE SAME

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(X0) 10879704: SEMICONDUCTOR DEVICE-BASED SENSORS

(A1) 20050285155: SEMICONDUCTOR DEVICE-BASED SENSORS

(B2) 7: SEMICONDUCTOR DEVICE-BASED SENSORS

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(X0) 11004628: III-NITRIDE MATERIAL STRUCTURES INCLUDING SILICON SUBSTRATES

(A1) 20060118819: III-NITRIDE MATERIAL STRUCTURES INCLUDING SILICON SUBSTRATES

(B2) 7: III-NITRIDE MATERIAL STRUCTURES INCLUDING SILICON SUBSTRATES

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(X0) 11839030: THERMAL DESIGNS OF PACKAGED GALLIUM NITRIDE MATERIAL DEVICES AND METHODS OF PACKAGING

(A1) 20100140665: THERMAL DESIGNS OF PACKAGED GALLIUM NITRIDE MATERIAL DEVICES AND METHODS OF PACKAGING

(B2) 8: THERMAL DESIGNS OF PACKAGED GALLIUM NITRIDE MATERIAL DEVICES AND METHODS OF PACKAGING

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(X0) 11839040: GALLIUM NITRIDE MATERIAL DEVICES AND THERMAL DESIGNS THEREOF

(B1) 7: GALLIUM NITRIDE MATERIAL DEVICES AND THERMAL DESIGNS THEREOF

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(X0) 12025976: GALLIUM NITRIDE MATERIAL DEVICES INCLUDING DIAMOND REGIONS AND METHODS ASSOCIATED WITH THE SAME

(A1) 20090194773: GALLIUM NITRIDE MATERIAL DEVICES INCLUDING DIAMOND REGIONS AND METHODS ASSOCIATED WITH THE SAME

(B2) 8: GALLIUM NITRIDE MATERIAL DEVICES INCLUDING DIAMOND REGIONS AND METHODS ASSOCIATED WITH THE SAME

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(X0) 12132985: PACKAGED GALLIUM NITRIDE MATERIAL TRANSISTORS AND METHODS ASSOCIATED WITH THE SAME

(A1) 20090109646: PACKAGED GALLIUM NITRIDE MATERIAL TRANSISTORS AND METHODS ASSOCIATED WITH THE SAME

(B2) 8: PACKAGED GALLIUM NITRIDE MATERIAL TRANSISTORS AND METHODS ASSOCIATED WITH THE SAME

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(X0) 12143727: GALLIUM NITRIDE MATERIAL PROCESSING AND RELATED DEVICE STRUCTURES

(A1) 20090267188: GALLIUM NITRIDE MATERIAL PROCESSING AND RELATED DEVICE STRUCTURES

(B2) 8: GALLIUM NITRIDE MATERIAL PROCESSING AND RELATED DEVICE STRUCTURES

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(X0) 12110816: EXTERNALLY CONFIGURABLE INTEGRATED CIRCUITS

(A1) 20090267079: EXTERNALLY CONFIGURABLE INTEGRATED CIRCUITS

(B2) 8: EXTERNALLY CONFIGURABLE INTEGRATED CIRCUITS