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Patent Assignment 47519/124

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

  • Reel/Frame: 47519/{124}
  • Execution Date: Nov 12, 2015
  • Correspondent

    LEE & HAYES, PC

    601 W RIVERSIDE
    SUITE 1400
    SPOKANE, WA 99201

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Patent Publication Application
METHOD AND APPARATUS FOR DIRECT TRANSFER OF SEMICONDUCTOR DEVICE DIE FROM A MAPPED WAFER (A1) 20180261581
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