Patent Assignment 43266/915

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

  • Reel/Frame: 43266/915
  • Execution Date: Jan 20, 2017
  • Correspondent

    ANDREW D. BOCHNER

    437 MADISON AVENUE
    WIGGIN AND DANA LLP, 35TH FLOOR
    NEW YORK, NY 10022

Properties

Patent Publication Application
Substrate Based Fan-Out Wafer Level Packaging (A1) 20180130769
May 10, 2018
(X0) 15674686
Aug 11, 2017