Patent Assignment 40383/663

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

  • Reel/Frame: 40383/663
  • Execution Date: Nov 15, 2016
  • Correspondent

    ANDREW D. BOCHNER

    450 LEXINGTON AVENUE
    WIGGIN AND DANA LLP, 38TH FLOOR
    NEW YORK, NY 10017

Properties

Patent Publication Application
Substrate Based Fan-Out Wafer Level Packaging (A1) 20180130720
May 10, 2018
(X0) 15347253
Nov 09, 2016