SEARCH RESULTS for assignee:"united microelectronics corp"

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(X0) 15844617: AUTOMATIC INLINE DETECTION AND WAFER DISPOSITION SYSTEM AND METHOD FOR AUTOMATIC INLINE DETECTION AND WAFER DISPOSITION

(A1) 20190187555: AUTOMATIC INLINE DETECTION AND WAFER DISPOSITION SYSTEM AND METHOD FOR AUTOMATIC INLINE DETECTION AND WAFER DISPOSITION

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(X0) 15847567: SEMICONDUCTOR CHIP

(A1) 20190189568: SEMICONDUCTOR CHIP

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(X0) 16209871: METHOD FOR FORMING PATTERNS

(A1) 20190187562: METHOD FOR FORMING PATTERNS

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(X0) 16285067: VIRTUAL METROLOGY SYSTEM AND METHOD

(A1) 20190187674: VIRTUAL METROLOGY SYSTEM AND METHOD

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(X0) 15206321: ELECTRICAL CHEMICAL PLATING PROCESS

(A1) 20160319450: ELECTRICAL CHEMICAL PLATING PROCESS

(B2) 1: ELECTRICAL CHEMICAL PLATING PROCESS

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(X0) 15673223: CHIP-STACK STRUCTURE

(A1) 20190027457: CHIP-STACK STRUCTURE

(B2) 1: CHIP-STACK STRUCTURE

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(X0) 15834519: STACKED SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

(A1) 20190181119: STACKED SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME

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(X0) 15839769: METHOD OF FABRICATING INTEGRATED CIRCUIT

(A1) 20190181046: METHOD OF FABRICATING INTEGRATED CIRCUIT

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(X0) 15607275: CONDUCTOR-INSULATOR-CONDUCTOR CAPACITOR AND METHOD OF FABRICATING THE SAME

(A1) 20180308635: CONDUCTOR-INSULATOR-CONDUCTOR CAPACITOR AND METHOD OF FABRICATING THE SAME

(B2) 1: CONDUCTOR-INSULATOR-CONDUCTOR CAPACITOR AND METHOD OF FABRICATING THE SAME

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(X0) 15830008: SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

(A1) 20190172752: SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

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(X0) 15859775: SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

(A1) 20190172753: SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

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(X0) 15439890: SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

(A1) 20170162389: SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

(B2) 1: SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

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(X0) 15613147: IMAGE SENSOR WITH PIXEL BINNING DEVICE

(A1) 20180352176: IMAGE SENSOR WITH PIXEL BINNING DEVICE

(B2) 1: IMAGE SENSOR WITH PIXEL BINNING DEVICE

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(X0) 15647031: METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

(A1) 20190019731: METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

(B2) 1: METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

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(X0) 15660982: HIGH VOLTAGE DEVICE

(A1) 20190006528: HIGH VOLTAGE DEVICE

(B2) 1: HIGH VOLTAGE DEVICE

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(X0) 15723186: SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

(A1) 20190103488: SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

(B2) 1: SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

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(X0) 15808019: METHOD FOR FORMING A SEMICONDUCTOR DEVICE

(A1) 20190139971: METHOD FOR FORMING A SEMICONDUCTOR DEVICE

(B2) 1: METHOD FOR FORMING A SEMICONDUCTOR DEVICE

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(X0) 15803852: MANUFACTURING METHOD OF MAGNETIC RANDOM ACCESS MEMORY CELL

(A1) 20190139959: MANUFACTURING METHOD OF MAGNETIC RANDOM ACCESS MEMORY CELL

(B2) 1: MANUFACTURING METHOD OF MAGNETIC RANDOM ACCESS MEMORY CELL

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(X0) 15878278: SEMICONDUCTOR DEVICE AND MANUFACTURING MEHOD THEREOF

(B1) 1: SEMICONDUCTOR DEVICE AND MANUFACTURING MEHOD THEREOF

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(X0) 15675811: MANUFACTURING METHOD OF INTEGRATED CIRCUIT

(A1) 20190051530: MANUFACTURING METHOD OF INTEGRATED CIRCUIT

(B2) 1: MANUFACTURING METHOD OF INTEGRATED CIRCUIT