SEARCH RESULTS for assignee:"taiwan semiconductor manufacturing company ltd"

Showing 1 to 20 of 594 results

Last Update Patent(s) Assignor(s) Orig. Assignee(s) Assignee(s) Reel/Frame
14-Jun-2018

(X0) 1: PHOTOMASK AND FABRICATION METHOD THEREFOR

(A1) 2: PHOTOMASK AND FABRICATION METHOD THEREFOR

CHANG, HAO-MING

LAI, CHIEN-HUNG

LIN, CHENG-MING

WANG, HSUAN-WEN

YANG, MIN-AN

HSU, S. C.

WEI, SHAO-CHI

CHU, YUAN-CHIH

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

41888/374

14-Jun-2018

(X0) 1: WIDE CHANNEL GATE STRUCTURE AND METHOD OF FORMING

(A1) 2: WIDE CHANNEL GATE STRUCTURE AND METHOD OF FORMING

WEI, CHIA-YU

CHANG, FU-CHENG

CHEN, HSIN-CHI

KAO, CHING-HUNG

CHENG, CHIA-PIN

LEE, KUO-CHENG

HUANG, HSUN-YING

LIN, YEN-LIANG

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

42326/383

14-Jun-2018

(X0) 1: SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER AND METHOD OF MAKING THE SAME

(A1) 2: SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER AND METHOD OF MAKING THE SAME

SHIH, YU-LUNG

LI, CHAO-KENG

KUO, ALAN

CHANG, C. C.

LIN, YI-AN

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

42649/465

14-Jun-2018

(X0) 1: POLISHING PAD AND METHOD OF USING

(A1) 2: POLISHING PAD AND METHOD OF USING

CHEN, CHUNHUNG

LI, JUNG-YU

WANG, SHENG-CHEN

HUANG, SHIH-SIAN

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

42983/931

14-Jun-2018

(X0) 1: METHOD OF FORMING SEMICONDUCTOR DEVICE USING TITANIUM-CONTAINING LAYER AND DEVICE FORMED

(A1) 2: METHOD OF FORMING SEMICONDUCTOR DEVICE USING TITANIUM-CONTAINING LAYER AND DEVICE FORMED

WU, CHIA-YANG

JANGJIAN, SHIU-KO

CHANG, KENG-CHUAN

SU, TING-SIANG

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

43897/544

14-Jun-2018

(X0) 1: Multi-Gate Device and Method of Fabrication Thereof

(A1) 2: Multi-Gate Device and Method of Fabrication Thereof

CHING, KUO-CHENG

HUANG, CHING-FANG

DIAZ, CARLOS H.

WANG, CHIH-HAO

HSIEH, WEN-HSING

LEUNG, YING-KEUNG

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

44756/746

14-Jun-2018

(X0) 1: METHOD OF FORMING CONDUCTIVE BUMPS FOR COOLING DEVICE CONNECTION

(A1) 2: METHOD OF FORMING CONDUCTIVE BUMPS FOR COOLING DEVICE CONNECTION

CHOU, YOU-HUA

LAI, YI-JEN

CHEN, CHUN-JEN

KAO, PERRE

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

44840/656

12-Jun-2018

(X0) 1: METHODS FOR TRANSPORTING WAFERS BETWEEN WAFER HOLDERS AND CHAMBERS

(A1) 2: METHODS FOR TRANSPORTING WAFERS BETWEEN WAFER HOLDERS AND CHAMBERS

(B2) 9: METHODS FOR TRANSPORTING WAFERS BETWEEN WAFER HOLDERS AND CHAMBERS

KU, SHAO-YEN

CHEN, MING-JUNG

CHUNG, TZU-YANG

TSENG, CHI-YUN

CHUANG, JUI-PING

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

27914/424

12-Jun-2018

(X0) 1: PROTECTION LAYER FOR ADHESIVE MATERIAL AT WAFER EDGE

(A1) 2: PROTECTION LAYER FOR ADHESIVE MATERIAL AT WAFER EDGE

(B2) 9: PROTECTION LAYER FOR ADHESIVE MATERIAL AT WAFER EDGE

CHIOU, WEN-CHIH

WU, WENG-JIN

SHUE, SHAU-LIN

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

30234/846

12-Jun-2018

(X0) 1: INTEGRATED CIRCUIT MODELING METHOD USING RESISTIVE CAPACITANCE INFORMATION

(A1) 2: INTEGRATED CIRCUIT MODELING METHOD USING RESISTIVE CAPACITANCE INFORMATION

(B2) 9: INTEGRATED CIRCUIT MODELING METHOD USING RESISTIVE CAPACITANCE INFORMATION

CHEN, CHIN-SHENG

YANG, TSUN-YU

HU, WEI-YI

KUAN, JUI-FENG

YANG, CHING-SHUN

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

34189/956

12-Jun-2018

(X0) 1: Method for Manufacturing A Microphone

(A1) 2: Method for Manufacturing A Microphone

(B2) 9: Method for Manufacturing A Microphone

PENG, JUNG-HUEI

CHU, CHIA-HUA

HUANG, YAO-TE

CHO, CHIN-YI

HUNG, LI-MIN

CHENG, CHUN-WEN

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

37721/887

12-Jun-2018

(X0) 1: SYSTEM AND METHOD FOR LITHOGRAPHY ALIGNMENT

(A1) 2: SYSTEM AND METHOD FOR LITHOGRAPHY ALIGNMENT

(B2) 9: SYSTEM AND METHOD FOR LITHOGRAPHY ALIGNMENT

LIN, YU-HSIEN

HSIEH, HUNG-CHANG

SHIU, FENG-JIA

LEE, CHUN-YI

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

38592/933

12-Jun-2018

(X0) 1: EXTREME ULTRAVIOLET LITHOGRAPHY PROCESS AND MASK

(A1) 2: EXTREME ULTRAVIOLET LITHOGRAPHY PROCESS AND MASK

(B2) 9: EXTREME ULTRAVIOLET LITHOGRAPHY PROCESS AND MASK

LU, YEN-CHENG

YU, SHINN-SHENG

CHEN, JENG-HORNG

YEN, ANTHONY

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

39167/729

12-Jun-2018

(X0) 1: DUMMY FEATURES IN REDISTRIBUTION LAYERS (RDLS) AND METHODS OF FORMING SAME

(A1) 2: DUMMY FEATURES IN REDISTRIBUTION LAYERS (RDLS) AND METHODS OF FORMING SAME

(B2) 9: DUMMY FEATURES IN REDISTRIBUTION LAYERS (RDLS) AND METHODS OF FORMING SAME

HSIEH, CHENG-HSIEN

HSU, LI-HAN

WU, WEI-CHENG

CHEN, HSIEN-WEI

YEH, DER-CHYANG

WU, CHI-HSI

YU, CHEN-HUA

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

39304/517

12-Jun-2018

(X0) 1: METHOD OF FORMING AN INTERCONNECT STRUCTURE FOR A SEMICONDUCTOR DEVICE

(A1) 2: METHOD OF FORMING AN INTERCONNECT STRUCTURE FOR A SEMICONDUCTOR DEVICE

(B2) 9: METHOD OF FORMING AN INTERCONNECT STRUCTURE FOR A SEMICONDUCTOR DEVICE

WU, YUNG-HSU

TSAI, CHENG-HSIUNG

CHANG, YU-SHENG

WU, CHIA-TIEN

LEE, CHUNG-JU

YEN, YUNG-SUNG

CHEN, CHUN-KUANG

BAO, TIEN-I

LIU, RU-GUN

SHUE, SHAU-LIN

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

39564/779

12-Jun-2018

(X0) 1: SEMICONDUCTOR DEVICE HAVING A STRAINED REGION

(A1) 2: SEMICONDUCTOR DEVICE HAVING A STRAINED REGION

(B2) 9: SEMICONDUCTOR DEVICE HAVING A STRAINED REGION

LEE, TSUNG-LIN

YUAN, FENG

CHIANG, HUNG-LI

YEH, CHIH CHIEH

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

40158/514

12-Jun-2018

(X0) 1: SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

(A1) 2: SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

(B2) 9: SEMICONDUCTOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

HUNG, JUI-PIN

HSU, FENG-CHENG

CHEN, SHUO-MAO

JENG, SHIN-PUU

LIAO, DE-DUI MARVIN

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

40592/52

12-Jun-2018

(X0) 1: Semiconductor Packages and Methods of Forming the Same

(A1) 2: Semiconductor Packages and Methods of Forming the Same

(B2) 9: Semiconductor Packages and Methods of Forming the Same

SHAO, TUNG-LIANG

TUNG, CHIH-HANG

YU, CHEN-HUA

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

40992/842

12-Jun-2018

(X0) 1: DELAY LINE CIRCUIT

(A1) 2: DELAY LINE CIRCUIT

(B2) 9: DELAY LINE CIRCUIT

HUANG, MING-CHIEH

CHERN, CHAN-HONG

HUANG, TSUNG-CHING (JIM)

LIN, CHIH-CHANG

YANG, TIEN-CHUN

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

41061/804

12-Jun-2018

(X0) 1: METHOD AND APPARATUS FOR INTEGRATED CIRCUIT LAYOUT

(A1) 2: METHOD AND APPARATUS FOR INTEGRATED CIRCUIT LAYOUT

(B2) 9: METHOD AND APPARATUS FOR INTEGRATED CIRCUIT LAYOUT

CHEN, YI-FAN

HSIEH, TUNG-HENG

HOU, CHIN-SHAN

WU, YU-BEY

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

44696/359