SEARCH RESULTS for assignee:"taiwan semiconductor manufacturing"

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(X0) 16121888: Bonding Through Multi-Shot Laser Reflow

(A1) 20190279958: Bonding Through Multi-Shot Laser Reflow

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(X0) 15965994: LOW POWER COMPARATOR AND SELF-REGULATED DEVICE

(A1) 20190277891: LOW POWER COMPARATOR AND SELF-REGULATED DEVICE

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(X0) 16049589: SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME

(A1) 20180337244: SEMICONDUCTOR DEVICE AND A METHOD FOR FABRICATING THE SAME

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(X0) 15909777: CONTACT STRUCTURE AND THE METHOD OF FORMING THE SAME

(A1) 20190273042: CONTACT STRUCTURE AND THE METHOD OF FORMING THE SAME

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(X0) 15909838: CONFORMAL METAL DIFFUSION BARRIER AND PLASMA TREATMENT FOR OXIDIZED METAL BARRIER

(A1) 20190273147: CONFORMAL METAL DIFFUSION BARRIER AND PLASMA TREATMENT FOR OXIDIZED METAL BARRIER

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(X0) 15909815: Metal Gate Fill for Semiconductor Devices

(A1) 20190273145: Metal Gate Fill for Semiconductor Devices

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(X0) 15909847: WET PROCESS ASSISTED APPROACH FOR SELECTIVE BARRIER METAL PATTERNING ON HIGH-K METAL GATE

(A1) 20190273149: WET PROCESS ASSISTED APPROACH FOR SELECTIVE BARRIER METAL PATTERNING ON HIGH-K METAL GATE

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(X0) 16410258: SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER

(A1) 20190273056: SEMICONDUCTOR DEVICE HAVING A PASSIVATION LAYER

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(X0) 16413904: INTER-DIGITATED CAPACITOR IN SPLIT-GATE FLASH TECHNOLOGY

(A1) 20190273091: INTER-DIGITATED CAPACITOR IN SPLIT-GATE FLASH TECHNOLOGY

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(X0) 16415918: EDGE DETECTOR CIRCUIT AND METHOD

(A1) 20190273500: EDGE DETECTOR CIRCUIT AND METHOD

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(X0) 16416871: MULTIPLEXER CIRCUIT, AND METHOD AND SYSTEM FOR GENERATING LAYOUT DIAGRAM CORRESPONDING TO SAME

(A1) 20190273495: MULTIPLEXER CIRCUIT, AND METHOD AND SYSTEM FOR GENERATING LAYOUT DIAGRAM CORRESPONDING TO SAME

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(X0) 16417068: PAD CONDITIONER AND METHOD OF CONDITIONING PLANARIZATION PAD

(A1) 20190270179: PAD CONDITIONER AND METHOD OF CONDITIONING PLANARIZATION PAD

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(X0) 16419280: PASSIVATION SCHEME FOR PAD OPENINGS AND TRENCHES

(A1) 20190273059: PASSIVATION SCHEME FOR PAD OPENINGS AND TRENCHES

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(X0) 15909762: Conductive Feature Formation and Structure

(A1) 20190273023: Conductive Feature Formation and Structure

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(X0) 15909682: CONTACT PLUG AND METHOD OF FORMATION

(A1) 20190273024: CONTACT PLUG AND METHOD OF FORMATION

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(X0) 16413937: METHOD AND APPARATUS FOR READING RRAM CELL

(A1) 20190272873: METHOD AND APPARATUS FOR READING RRAM CELL

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(X0) 16415870: COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR IMAGE SENSOR

(A1) 20190273112: COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR IMAGE SENSOR

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(X0) 13623814: SEMICONDUCTOR APPARATUS WITH INNER WAFER CARRIER BUFFER AND METHOD

(A1) 20140075774: SEMICONDUCTOR APPARATUS WITH INNER WAFER CARRIER BUFFER AND METHOD

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(B2) 10403532: SEMICONDUCTOR APPARATUS WITH INNER WAFER CARRIER BUFFER AND METHOD

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(X0) 13969303: LIQUID SUPPLY SYSTEM AND METHOD

(A1) 20150048035: LIQUID SUPPLY SYSTEM AND METHOD

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(B2) 10399018: LIQUID SUPPLY SYSTEM AND METHOD

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(X0) 14527381: CIRCUIT LAYOUT, LAYOUT METHOD AND SYSTEM FOR IMPLEMENTING THE METHOD

(A1) 20160126232: CIRCUIT LAYOUT, LAYOUT METHOD AND SYSTEM FOR IMPLEMENTING THE METHOD

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(B2) 10403621: CIRCUIT LAYOUT, LAYOUT METHOD AND SYSTEM FOR IMPLEMENTING THE METHOD