SEARCH RESULTS for assignee:"taiwan semiconductor manufacturing"

Showing 1 to 20 of 1,529 results

Last Update Patent(s) Assignor(s) Orig. Assignee(s) Assignee(s) Reel/Frame
07-Sep-2018

(X0) 15710506: NOVEL PHASE-LOCKED-LOOP ARCHITECTURE

(A1) 20180167073: NOVEL PHASE-LOCKED-LOOP ARCHITECTURE

SHEN, RUEY-BIN

TSAI, TSUNG-HSIEN

CHANG, CHIH-HSIEN

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

46801/450

06-Sep-2018

(X0) 15448690: ISOLATION STRUCTURE FOR REDUCING CROSSTALK BETWEEN PIXELS AND FABRICATION METHOD THEREOF

(A1) 20180254294: ISOLATION STRUCTURE FOR REDUCING CROSSTALK BETWEEN PIXELS AND FABRICATION METHOD THEREOF

CHENG, YUN-WEI

HUANG, YIN-CHIEH

CHOU, CHUN-HAO

LEE, KUO-CHENG

HUANG, HSUN-YING

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

41452/805

06-Sep-2018

(X0) 15971181: Method to Mitigate Defect Printability for ID Pattern

(A1) 20180253008: Method to Mitigate Defect Printability for ID Pattern

LU, YEN-CHENG

HSU, CHIA-HAO

YU, SHINN-SHENG

CHEN, CHIA-CHEN

CHEN, JENG-HORNG

YEN, ANTHONY

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

45716/540

06-Sep-2018

(X0) 15972961: SEMICONDUCTOR DEVICE INCLUDING FIN STRUCTURE WITH TWO CHANNEL LAYERS AND MANUFACTURING METHOD THEREOF

(A1) 20180254347: SEMICONDUCTOR DEVICE INCLUDING FIN STRUCTURE WITH TWO CHANNEL LAYERS AND MANUFACTURING METHOD THEREOF

LEE, TUNG YING

SU, CHIEN-CHANG

HUANG, WANG-CHUN

OKUNO, YASUTOSHI

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

45742/418

06-Sep-2018

(X0) 15966873: Chip Package Having Die Structures of Different Heights and Method of Forming Same

(A1) 20180254260: Chip Package Having Die Structures of Different Heights and Method of Forming Same

WEI, WEN-HSIN

HU, HSIEN-PIN

HOU, SHANG-YUN

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

45989/133

31-Aug-2018

(X0) 15875788: Orientation Layer for Directed Self-Assembly Patterning Process

(A1) 20180144928: Orientation Layer for Directed Self-Assembly Patterning Process

KO, TSUNG-HAN

CHANG, CHING-YU

LO, KUAN-HSIN

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

46750/978

30-Aug-2018

(X0) 15725677: Integrated Devices in Semiconductor Packages and Methods of Forming Same

(A1) 20180247905: Integrated Devices in Semiconductor Packages and Methods of Forming Same

YU, CHEN-HUA

WU, KAI-CHIANG

LIU, CHUNG-SHI

CHANG, SHOU-ZEN

SHIH, CHAO-WEN

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

44397/296

30-Aug-2018

(X0) 15874478: METHOD AND SYSTEM FOR SIGMA-BASED TIMING OPTIMIZATION

(A1) 20180247007: METHOD AND SYSTEM FOR SIGMA-BASED TIMING OPTIMIZATION

CHEN, YEN-PIN

LIN, TZU-HEN

CHENG, TAI-YU

DARTU, FLORIN

WANG, CHUNG-HSING

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

45006/420

30-Aug-2018

(X0) 15442225: SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

(A1) 20180248112: SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

CHUANG, HARRY-HAK-LAY

HUANG, SHENG-HUANG

WANG, HUNG CHO

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

42301/124

30-Aug-2018

(X0) 15959459: HEMT-COMPATIBLE LATERAL RECTIFIER STRUCTURE

(A1) 20180248009: HEMT-COMPATIBLE LATERAL RECTIFIER STRUCTURE

WONG, KING-YUEN

TSAI, MING-WEI

CHIU, HAN-CHIN

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

45608/739

30-Aug-2018

(A1) 20180247937: Method of Forming a Single Metal that Performs N Work Function and P Work Function in a High-K/Metal Gate Process

(X0) 15961935: Method of Forming a Single Metal that Performs N Work Function and P Work Function in a High-K/Metal Gate Process

LIN, YIH-ANN

CHEN, RYAN CHIA-JEN

CHAO, DONALD Y.

MOR, YI-SHIEN

HUANG, KUO-TAI

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

45628/898

30-Aug-2018

(X0) 15966382: SEMICONDUCTOR PACKAGE

(A1) 20180247900: SEMICONDUCTOR PACKAGE

LIN, JING-CHENG

CHANG, CHIN-CHUAN

HUNG, JUI-PIN

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

45668/701

30-Aug-2018

(X0) 15966682: FINFET DOPING METHODS AND STRUCTURES THEREOF

(A1) 20180247829: FINFET DOPING METHODS AND STRUCTURES THEREOF

HOU, CHENG-HAO

YU, XIONG-FEI

HSU, CHIA-WEI

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

45671/748

30-Aug-2018

(X0) 15968316: Methods and Systems for Chemical Mechanical Polish Cleaning

(A1) 20180247838: Methods and Systems for Chemical Mechanical Polish Cleaning

LEE, CHIEN-PING

HUANG, HUI-CHI

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD

45685/279

30-Aug-2018

(X0) 15964526: Apparatus For Reducing Optical Cross-Talk In Image Sensors

(A1) 20180247971: Apparatus For Reducing Optical Cross-Talk In Image Sensors

LIN, CHIN-MIN

YAUNG, DUN-NIAN

WANG, CHING-CHUN

HSU, TZU-HSUAN

SU, CHUN-MING

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

45685/404

28-Aug-2018

(X0) 15017234: SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

(A1) 20170229568: SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

(B2) 1: SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

CHEN, PO-CHIH

YU, JIUN-LEI

CHANG, YAO-CHUNG

TSAI, CHUN-LIN

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

38705/394

28-Aug-2018

(X0) 15182348: PATTERNING METHOD AND PATTERNING APPARATUS FOR FABRICATING A RESIST PATTERN

(A1) 20170277044: PATTERNING METHOD AND PATTERNING APPARATUS FOR FABRICATING A RESIST PATTERN

(B2) 1: PATTERNING METHOD AND PATTERNING APPARATUS FOR FABRICATING A RESIST PATTERN

LEE, YUNG-YAO

PENG, JUI-CHUN

CHEN, HO-PING

LIU, HENG-HSIN

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

38912/506

28-Aug-2018

(X0) 15219599: METHOD OF OPERATING A PULL-UP CIRCUIT

(A1) 20160336939: METHOD OF OPERATING A PULL-UP CIRCUIT

(B2) 1: METHOD OF OPERATING A PULL-UP CIRCUIT

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

39258/638

28-Aug-2018

(X0) 15170653: SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

(A1) 20170250138: SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

(B2) 1: SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

HSIEH, CHENG-HSIEN

HSU, LI-HAN

WU, WEI-CHENG

CHEN, HSIEN-WEI

YEH, DER-CHYANG

WU, CHI-HSI

YU, CHEN-HUA

LIN, TSUNG-SHU

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

38788/634

28-Aug-2018

(X0) 15223483: AIR-GAP SCHEME FOR BEOL PROCESS

(A1) 20160336216: AIR-GAP SCHEME FOR BEOL PROCESS

(B2) 1: AIR-GAP SCHEME FOR BEOL PROCESS

HSIAO, RU-SHANG

CHANG, CHIH-FU

WANG, JEN-PAN

TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

39291/392