SEARCH RESULTS for assignee:"sk hynix"

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(X0) 15607242: DEEP LEARNING FOR LOW-DENSITY PARITY-CHECK (LDPC) DECODING

(A1) 20180343017: DEEP LEARNING FOR LOW-DENSITY PARITY-CHECK (LDPC) DECODING

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(X0) 15607234: GENERALIZED LOW-DENSITY PARITY-CHECK (GLDPC) CODE WITH VARIABLE LENGTH CONSTITUENTS

(A1) 20180343020: GENERALIZED LOW-DENSITY PARITY-CHECK (GLDPC) CODE WITH VARIABLE LENGTH CONSTITUENTS

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(X0) 15830901: DATA STORAGE DEVICE AND OPERATING METHOD THEREOF

(A1) 20180341557: DATA STORAGE DEVICE AND OPERATING METHOD THEREOF

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(X0) 15832005: DATA PROCESSING SYSTEM AND DATA PROCESSING METHOD

(A1) 20180341577: DATA PROCESSING SYSTEM AND DATA PROCESSING METHOD

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(X0) 15858516: OUTPUT DRIVING CIRCUIT

(A1) 20180343008: OUTPUT DRIVING CIRCUIT

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(X0) 15866635: SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

(A1) 20180342520: SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

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(X0) 16037776: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

(A1) 20180342533: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

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(X0) 15696865: SEMICONDUCTOR DEVICE, TEST METHOD, AND SYSTEM INCLUDING THE SAME

(A1) 20180342430: SEMICONDUCTOR DEVICE, TEST METHOD, AND SYSTEM INCLUDING THE SAME

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(X0) 15838493: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

(A1) 20180342528: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

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(X0) 15860778: SEMICONDUCTOR DEVICE AND MEMORY SYSTEM HAVING INPUT BUFFER CIRCUIT

(A1) 20180342280: SEMICONDUCTOR DEVICE AND MEMORY SYSTEM HAVING INPUT BUFFER CIRCUIT

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(X0) 15987586: SEMICONDUCTOR DEVICE, SEMICONDUCTOR SYSTEM INCLUDING THE SAME AND OPERATING METHOD FOR A SEMICONDUCTOR SYSTEM

(A1) 20180342285: SEMICONDUCTOR DEVICE, SEMICONDUCTOR SYSTEM INCLUDING THE SAME AND OPERATING METHOD FOR A SEMICONDUCTOR SYSTEM

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(X0) 15607260: EARLY TERMINATION OF LOW-DENSITY PARITY-CHECK (LDPC) DECODING

(A1) 20180343082: EARLY TERMINATION OF LOW-DENSITY PARITY-CHECK (LDPC) DECODING

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(X0) 15817489: MEMORY SYSTEM AND OPERATION METHOD THEREOF

(A1) 20180341576: MEMORY SYSTEM AND OPERATION METHOD THEREOF

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(X0) 15829260: SEMICONDUCTOR PACKAGES INCLUDING STACKED CHIPS

(A1) 20180342481: SEMICONDUCTOR PACKAGES INCLUDING STACKED CHIPS

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(X0) 15857016: SEMICONDUCTOR DEVICE INCLUDING BURIED GATE STRUCTURE AND METHOD FOR FABRICATING THE SAME

(A1) 20180342518: SEMICONDUCTOR DEVICE INCLUDING BURIED GATE STRUCTURE AND METHOD FOR FABRICATING THE SAME

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(X0) 15985085: SEMICONDUCTOR DEVICE AND METHOD FOR CONTROLLING A REFRESH OPERATION AND A MEMORY SYSTEM INCLUDING THE SAME

(A1) 20180342284: SEMICONDUCTOR DEVICE AND METHOD FOR CONTROLLING A REFRESH OPERATION AND A MEMORY SYSTEM INCLUDING THE SAME

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(X0) 16054777: SEMICONDUCTOR SYSTEM

(A1) 20180342275: SEMICONDUCTOR SYSTEM

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(X0) 16057070: DATA STORAGE DEVICE AND OPERATING METHOD THEREOF

(A1) 20180341583: DATA STORAGE DEVICE AND OPERATING METHOD THEREOF

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(X0) 15715449: STACKED SEMICONDUCTOR PACKAGE HAVING MOLD VIAS AND METHOD FOR MANUFACTURING THE SAME

(A1) 20180331087: STACKED SEMICONDUCTOR PACKAGE HAVING MOLD VIAS AND METHOD FOR MANUFACTURING THE SAME

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