SEARCH RESULTS for assignee:"micron technology"

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(X0) 15591015: SENSE AMPLIFIER SIGNAL BOOST

(A1) 20180330766: SENSE AMPLIFIER SIGNAL BOOST

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(X0) 15592027: Assemblies Which Include Wordlines Over Gate Electrodes

(A1) 20180331029: Assemblies Which Include Wordlines Over Gate Electrodes

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(X0) 15590863: SEMICONDUCTOR STRUCTURES, MEMORY CELLS AND DEVICES COMPRISING FERROELECTRIC MATERIALS, SYSTEMS INCLUDING SAME, AND RELATED METHODS

(A1) 20180331113: SEMICONDUCTOR STRUCTURES, MEMORY CELLS AND DEVICES COMPRISING FERROELECTRIC MATERIALS, SYSTEMS INCLUDING SAME, AND RELATED METHODS

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(X0) 15591700: RESPONDING TO POWER LOSS

(A1) 20180330793: RESPONDING TO POWER LOSS

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(X0) 15590972: APPARATUSES AND METHODS FOR CONFIGURABLE COMMAND AND DATA INPUT CIRCUITS FOR SEMICONDUCTOR MEMORIES

(A1) 20180330775: APPARATUSES AND METHODS FOR CONFIGURABLE COMMAND AND DATA INPUT CIRCUITS FOR SEMICONDUCTOR MEMORIES

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(X0) 15590143: REFRESH IN MEMORY BASED ON A SET MARGIN

(A1) 20180330774: REFRESH IN MEMORY BASED ON A SET MARGIN

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(X0) 16043959: APPARATUSES AND METHODS FOR DATA TRANSFER FROM SENSING CIRCUITRY TO A CONTROLLER

(A1) 20180329648: APPARATUSES AND METHODS FOR DATA TRANSFER FROM SENSING CIRCUITRY TO A CONTROLLER

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(X0) 16045550: APPARATUSES INCLUDING ELECTRODES HAVING A CONDUCTIVE BARRIER MATERIAL AND METHODS OF FORMING SAME

(A1) 20180331287: APPARATUSES INCLUDING ELECTRODES HAVING A CONDUCTIVE BARRIER MATERIAL AND METHODS OF FORMING SAME

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(X0) 16046859: PROXIMITY COUPLING INTERCONNECT PACKAGING SYSTEMS AND METHODS

(A1) 20180331089: PROXIMITY COUPLING INTERCONNECT PACKAGING SYSTEMS AND METHODS

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(X0) 16032283: APPARATUSES AND METHODS FOR IN-MEMORY OPERATIONS

(A1) 20180330776: APPARATUSES AND METHODS FOR IN-MEMORY OPERATIONS

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(X0) 16044099: MEMORY APPARATUS WITH POST PACKAGE REPAIR

(A1) 20180330799: MEMORY APPARATUS WITH POST PACKAGE REPAIR

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(X0) 15944455: MEMORY DEVICE LOOPBACK SYSTEMS AND METHODS

(A1) 20180294044: MEMORY DEVICE LOOPBACK SYSTEMS AND METHODS

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(X0) 15595171: BANK TO BANK DATA TRANSFER

(A1) 20180330767: BANK TO BANK DATA TRANSFER

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(X0) 15969302: PLATE NODE CONFIGURATIONS AND OPERATIONS FOR A MEMORY ARRAY

(A1) 20180331114: PLATE NODE CONFIGURATIONS AND OPERATIONS FOR A MEMORY ARRAY

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(X0) 16026500: METHOD AND APPARATUS FOR A VOLUME MANAGEMENT SYSTEM IN A NON-VOLATILE MEMORY DEVICE

(A1) 20180329775: METHOD AND APPARATUS FOR A VOLUME MANAGEMENT SYSTEM IN A NON-VOLATILE MEMORY DEVICE

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(X0) 16040515: APPARATUSES INCLUDING ELECTRODES HAVING A CONDUCTIVE BARRIER MATERIAL AND METHODS OF FORMING SAME

(A1) 20180331285: APPARATUSES INCLUDING ELECTRODES HAVING A CONDUCTIVE BARRIER MATERIAL AND METHODS OF FORMING SAME

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(X0) 16040521: APPARATUSES INCLUDING ELECTRODES HAVING A CONDUCTIVE BARRIER MATERIAL AND METHODS OF FORMING SAME

(A1) 20180331286: APPARATUSES INCLUDING ELECTRODES HAVING A CONDUCTIVE BARRIER MATERIAL AND METHODS OF FORMING SAME

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(X0) 16045384: APPARATUSES AND METHODS FOR ACCESSING MEMORY CELLS

(A1) 20180330781: APPARATUSES AND METHODS FOR ACCESSING MEMORY CELLS

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(X0) 16046201: SYSTEMS AND METHODS FOR WAFER ALIGNMENT

(A1) 20180330976: SYSTEMS AND METHODS FOR WAFER ALIGNMENT