SEARCH RESULTS for assignee:"lam research"

Showing 1 to 20 of 198 results

Last Update Patent(s) Assignor(s) Orig. Assignee(s) Assignee(s) Reel/Frame
06-Sep-2018

(X0) 15446631: WIDE LIPSEAL FOR ELECTROPLATING

(A1) 20180251907: WIDE LIPSEAL FOR ELECTROPLATING

THORKELSSON, KARI

BERKE, AARON

KUMAR, SANTOSH

RASH, ROBERT

CHUA, LEE PENG

BUCKALEW, BRYAN

LAM RESEARCH CORPORATION

41425/583

06-Sep-2018

(X0) 15449333: WAFER LEVEL UNIFORMITY CONTROL IN REMOTE PLASMA FILM DEPOSITION

(A1) 20180251893: WAFER LEVEL UNIFORMITY CONTROL IN REMOTE PLASMA FILM DEPOSITION

HOHN, GEOFFREY

QIU, HUATAN

BATZER, RACHEL

YUAN, GUANGBI

GUI, ZHE

LAM RESEARCH CORPORATION

41464/51

30-Aug-2018

(X0) 15615691: CONTROL OF DIRECTIONALITY IN ATOMIC LAYER ETCHING

(A1) 20180247832: CONTROL OF DIRECTIONALITY IN ATOMIC LAYER ETCHING

FISCHER, ANDREAS

LILL, THORSTEN

JANEK, RICHARD

LAM RESEARCH CORPORATION

42870/174

30-Aug-2018

(X0) 15615691: CONTROL OF DIRECTIONALITY IN ATOMIC LAYER ETCHING

(A1) 20180247832: CONTROL OF DIRECTIONALITY IN ATOMIC LAYER ETCHING

FISCHER, ANDREAS

LILL, THORSTEN

JANEK, RICHARD

LAM RESEARCH CORPORATION

42813/409

30-Aug-2018

(X0) 15969583: SYSTEMS FOR COOLING RF HEATED CHAMBER COMPONENTS

(A1) 20180247796: SYSTEMS FOR COOLING RF HEATED CHAMBER COMPONENTS

MCCHESNEY, JON

SRIRAMAN, SARAVANAPRIYAN

MARSH, RICHARD A.

PATERSON, ALEXANDER MILLER

HOLLAND, JOHN

LAM RESEARCH CORPORATION

45708/120

28-Aug-2018

(X0) 15201221: SELECTIVE ATOMIC LAYER DEPOSITION WITH POST-DOSE TREATMENT

(A1) 20180005814: SELECTIVE ATOMIC LAYER DEPOSITION WITH POST-DOSE TREATMENT

(B2) 1: SELECTIVE ATOMIC LAYER DEPOSITION WITH POST-DOSE TREATMENT

KUMAR, PURUSHOTTAM

LAVOIE, ADRIEN

KARIM, ISHTAK

QIAN, JUN

PASQUALE, FRANK L.

LAM RESEARCH CORPORATION

39296/62

28-Aug-2018

(X0) 15048960: AUTOMATED REPLACEMENT OF CONSUMABLE PARTS USING INTERFACING CHAMBERS

(A1) 20170117172: AUTOMATED REPLACEMENT OF CONSUMABLE PARTS USING INTERFACING CHAMBERS

(B2) 1: AUTOMATED REPLACEMENT OF CONSUMABLE PARTS USING INTERFACING CHAMBERS

GENETTI, DAMON TYRONE

MCCHESNEY, JON

PATERSON, ALEX

WITKOWICKI, DEREK JOHN

NGO, AUSTIN

LAM RESEARCH CORPORATION

37804/247

24-Jul-2018

(X0) 15059073: ETCH METRIC SENSITIVITY FOR ENDPOINT DETECTION

(A1) 20170256463: ETCH METRIC SENSITIVITY FOR ENDPOINT DETECTION

(B2) 1: ETCH METRIC SENSITIVITY FOR ENDPOINT DETECTION

BAILEY III, ANDREW D.

TETIKER, MEHMET DERYA

MILLS, DUNCAN W.

LAM RESEARCH CORPORATION

37881/34

28-Jun-2018

(X0) 15389930: HIGH POWER LOW PRESSURE UV BULB WITH PLASMA RESISTANT COATING

(A1) 20180182607: HIGH POWER LOW PRESSURE UV BULB WITH PLASMA RESISTANT COATING

CHEN, XIAOLAN

MUDROW, MATTHEW

BAILEY, CURTIS

LAU, STEPHEN

LAMAR, MITCHELL

LAM RESEARCH CORPORATION

40809/860

28-Jun-2018

(A1) 20180182632: Method of Feature Exaction from Time-series of Spectra to Control Endpoint of Process

(X0) 15389451: Method of Feature Exaction from Time-series of Spectra to Control Endpoint of Process

FENG, YE

KUMAR, PRASHANTH

BAILEY, ANDREW D., III

LAM RESEARCH CORPORATION

40939/360

28-Jun-2018

(X0) 15849306: ATOMIC LAYER ETCHING METHODS AND APPARATUS

(A1) 20180182634: ATOMIC LAYER ETCHING METHODS AND APPARATUS

SMITH, DAVID

LILL, THORSTEN

FISCHER, ANDREAS

LAM RESEARCH CORPORATION

44994/779

26-Jun-2018

(X0) 14730457: METHOD FOR COLLAPSE-FREE DRYING OF HIGH ASPECT RATIO STRUCTURES

(A1) 20160099160: METHOD FOR COLLAPSE-FREE DRYING OF HIGH ASPECT RATIO STRUCTURES

(B2) 1: METHOD FOR COLLAPSE-FREE DRYING OF HIGH ASPECT RATIO STRUCTURES

SIRARD, STEPHEN M.

LIMARY, RATCHANA

LAM RESEARCH CORPORATION

35821/81

21-Jun-2018

(A1) 20180175819: SYSTEMS AND METHODS FOR PROVIDING SHUNT CANCELLATION OF PARASITIC COMPONENTS IN A PLASMA REACTOR

(X0) 15382409: SYSTEMS AND METHODS FOR PROVIDING SHUNT CANCELLATION OF PARASITIC COMPONENTS IN A PLASMA REACTOR

RANGINENI, YASWANTH

KAPOOR, SUNIL

AUGUSTYNIAK, EDWARD

SAKIYAMA, YUKINORI

LAM RESEARCH CORPORATION

40670/357

21-Jun-2018

(X0) 15385813: CONICAL WAFER CENTERING AND HOLDING DEVICE FOR SEMICONDUCTOR PROCESSING

(A1) 20180171473: CONICAL WAFER CENTERING AND HOLDING DEVICE FOR SEMICONDUCTOR PROCESSING

AGARWAL, PULKIT

KARIM, ISHTAK

KUMAR, PURUSHOTTAM

LAVOIE, ADRIEN

KIM, SUNG JE

BREILING, PATRICK

LAM RESEARCH CORPORATION

41169/248

21-Jun-2018

(A1) 20180174901: CHAMBER CONDITIONING FOR REMOTE PLASMA PROCESS

(X0) 15384175: CHAMBER CONDITIONING FOR REMOTE PLASMA PROCESS

WANG, DEQI

LIU, GANG

CHANDRASHEKAR, ANAND

YANG, TSUNG-HAN

GRISWOLD, JACK

LAM RESEARCH CORPORATION

41478/818

21-Jun-2018

(X0) 15381594: METHOD FOR PROVIDING A LOW-k SPACER

(A1) 20180175161: METHOD FOR PROVIDING A LOW-k SPACER

WILD, STRAFORD A.

TESSIER, BRIAN

LAM RESEARCH CORPORATION

40668/525

21-Jun-2018

(X0) 15824447: SYSTEM AND METHOD FOR CALCULATING SUBSTRATE SUPPORT TEMPERATURE

(A1) 20180173255: SYSTEM AND METHOD FOR CALCULATING SUBSTRATE SUPPORT TEMPERATURE

WETZEL, DAVID JOSEPH

BLEAKIE, ALEXANDER

THEISEN, JACOB FREDERICK

LAM RESEARCH CORPORATION

44238/285

21-Jun-2018

(X0) 15841205: DESIGNER ATOMIC LAYER ETCHING

(A1) 20180174860: DESIGNER ATOMIC LAYER ETCHING

LAM RESEARCH CORPORATION

44397/923

21-Jun-2018

(X0) 15845206: SYSTEMS AND METHODS FOR METASTABLE ACTIVATED RADICAL SELECTIVE STRIP AND ETCH USING DUAL PLENUM SHOWERHEAD

(A1) 20180174870: SYSTEMS AND METHODS FOR METASTABLE ACTIVATED RADICAL SELECTIVE STRIP AND ETCH USING DUAL PLENUM SHOWERHEAD

YANG, DENGLIANG

CHEUNG, DAVID

FANG, HAOQUAN

AMBUROSE, GNANAMANI

KO, EUNSUK

LUO, WEI YI

ZHANG, DAN

LAM RESEARCH CORPORATION

44482/411

19-Jun-2018

(X0) 15290890: METHOD FOR SELECTIVELY ETCHING SILICON OXIDE WITH RESPECT TO AN ORGANIC MASK

(A1) 20180102257: METHOD FOR SELECTIVELY ETCHING SILICON OXIDE WITH RESPECT TO AN ORGANIC MASK

(B2) 1: METHOD FOR SELECTIVELY ETCHING SILICON OXIDE WITH RESPECT TO AN ORGANIC MASK

NAGABHIRAVA, BHASKAR

BASAVALINGAPPA, ADARSH

WANG, PENG

GAPALADASU, PRABHAKARA

GOSS, MICHAEL

LAM RESEARCH CORPORATION

40015/201