SEARCH RESULTS for assignee:"lam research"

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(A1) 20190279888: Mass Flow Controller for Substrate Processing

(X0) 15917528: Mass Flow Controller for Substrate Processing

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(X0) 14192416: DEVICE AND METHOD FOR REMOVING LIQUID FROM A SURFACE OF A DISC-LIKE ARTICLE

(A1) 20150243533: DEVICE AND METHOD FOR REMOVING LIQUID FROM A SURFACE OF A DISC-LIKE ARTICLE

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(B2) 10410888: DEVICE AND METHOD FOR REMOVING LIQUID FROM A SURFACE OF A DISC-LIKE ARTICLE

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(X0) 15910739: QUARTZ COMPONENT WITH PROTECTIVE COATING

(A1) 20190272981: QUARTZ COMPONENT WITH PROTECTIVE COATING

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(X0) 15903682: MULTI-PLATE ELECTROSTATIC CHUCKS WITH CERAMIC BASEPLATES

(A1) 20190267218: MULTI-PLATE ELECTROSTATIC CHUCKS WITH CERAMIC BASEPLATES

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(X0) 15906332: METHOD MONITORING CHAMBER DRIFT

(A1) 20190267268: METHOD MONITORING CHAMBER DRIFT

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(X0) 14104356: ELECTROSTATIC CHUCK CLEANING FIXTURE

(A1) 20150165492: ELECTROSTATIC CHUCK CLEANING FIXTURE

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(B2) 10391526: ELECTROSTATIC CHUCK CLEANING FIXTURE

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(X0) 15902861: Feedback Control System for Iterative Etch Process

(A1) 20190259674: Feedback Control System for Iterative Etch Process

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(X0) 13234473: COMPONENT OF A SUBSTRATE SUPPORT ASSEMBLY PRODUCING LOCALIZED MAGNETIC FIELDS

(A1) 20130072025: COMPONENT OF A SUBSTRATE SUPPORT ASSEMBLY PRODUCING LOCALIZED MAGNETIC FIELDS

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(B2) 10388493: COMPONENT OF A SUBSTRATE SUPPORT ASSEMBLY PRODUCING LOCALIZED MAGNETIC FIELDS

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(X0) 15888719: TAPERED UPPER ELECTRODE FOR UNIFORMITY CONTROL IN PLASMA PROCESSING

(A1) 20190244793: TAPERED UPPER ELECTRODE FOR UNIFORMITY CONTROL IN PLASMA PROCESSING

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(X0) 15883787: METHOD TO SELECTIVELY PATTERN A SURFACE FOR PLASMA RESISTANT COAT APPLICATIONS

(A1) 20190233658: METHOD TO SELECTIVELY PATTERN A SURFACE FOR PLASMA RESISTANT COAT APPLICATIONS

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(X0) 15886098: ELECTROSTATIC CHUCKING PEDESTAL WITH SUBSTRATE BACKSIDE PURGING AND THERMAL SINKING

(A1) 20190237353: ELECTROSTATIC CHUCKING PEDESTAL WITH SUBSTRATE BACKSIDE PURGING AND THERMAL SINKING

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(X0) 15881506: SPACER PROFILE CONTROL USING ATOMIC LAYER DEPOSITION IN A MULTIPLE PATTERNING PROCESS

(A1) 20190237330: SPACER PROFILE CONTROL USING ATOMIC LAYER DEPOSITION IN A MULTIPLE PATTERNING PROCESS

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(X0) 15867106: TUNABLE ESC FOR RAPID ALTERNATING PROCESS APPLICATIONS

(A1) 20190214236: TUNABLE ESC FOR RAPID ALTERNATING PROCESS APPLICATIONS

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(X0) 15867205: DYNAMIC COOLANT MIXING MANIFOLD

(A1) 20190214279: DYNAMIC COOLANT MIXING MANIFOLD

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(X0) 15842763: Corrosion-Resistant Temperature Sensor Probe

(A1) 20190187003: Corrosion-Resistant Temperature Sensor Probe

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(X0) 15845910: SELF-ASSEMBLED MONOLAYERS AS AN ETCHANT IN ATOMIC LAYER ETCHING

(A1) 20190189462: SELF-ASSEMBLED MONOLAYERS AS AN ETCHANT IN ATOMIC LAYER ETCHING

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(X0) 15847234: METHOD FOR FORMING SQUARE SPACERS

(A1) 20190189447: METHOD FOR FORMING SQUARE SPACERS

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(X0) 15954454: EX SITU COATING OF CHAMBER COMPONENTS FOR SEMICONDUCTOR PROCESSING

(A1) 20190185999: EX SITU COATING OF CHAMBER COMPONENTS FOR SEMICONDUCTOR PROCESSING

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(X0) 15837707: KNURLING EDGE DRIVING TOOL

(A1) 20190176280: KNURLING EDGE DRIVING TOOL

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(X0) 16000734: AUTO-CALIBRATION TO A STATION OF A PROCESS MODULE THAT SPINS A WAFER

(A1) 20190172738: AUTO-CALIBRATION TO A STATION OF A PROCESS MODULE THAT SPINS A WAFER